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XEC24P3-30G Scheda tecnica(PDF) 14 Page - Anaren Microwave

Il numero della parte XEC24P3-30G
Spiegazioni elettronici  Production Friendly
Download  19 Pages
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Produttore elettronici  ANAREN [Anaren Microwave]
Homepage  http://www.anaren.com
Logo ANAREN - Anaren Microwave

XEC24P3-30G Scheda tecnica(HTML) 14 Page - Anaren Microwave

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USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
Model XEC24P3-30G
Rev B
Mounting
In order for Xinger surface mount couplers to work
optimally, there must be 50Ω transmission lines
leading to and from all of the RF ports. Also, there
must be a very good ground plane underneath the
part to ensure proper electrical performance.
If
either of these two conditions is not satisfied,
electrical performance may not meet published
specifications.
Overall ground is improved if a dense population of
plated through holes connect the top and bottom
ground layers of the PCB. This minimizes ground
inductance and improves ground continuity. All of
the Xinger hybrid and directional couplers are
constructed from ceramic filled PTFE composites
which possess excellent electrical and mechanical
stability having X and Y thermal coefficient of
expansion (CTE) of 17-25 ppm/
oC.
When a surface mount coupler is mounted to a
printed circuit board, the primary concerns are;
ensuring the RF pads of the device are in contact
with the circuit trace of the PCB and insuring the
ground plane of neither the component nor the PCB
is in contact with the RF signal.
Mounting Footprint
.170
[4.32]
.120
[3.05]
.034
[0.86]
4x 50
Transmission
Line
Multiple plated thru
holes to ground
To ensure proper electrical and thermal
performance there must be a ground plane with
100% solder connection underneath the part
orientated as shown with text facing up
Dimensions are in Inches [Millimeters]
XEC24P3-30G Mounting Footprint
Coupler Mounting Process
The process for assembling this component is a
conventional surface mount process as shown in Figure
1. This process is conducive to both low and high
volume usage.
Figure 1: Surface Mounting Process Steps
Storage of Components:
The Xinger Couplers are
available in ENIG finish. Dry packaging will be effective
for a least one year if stored at less than 40 °C and 90%
RH (see IPC/JEDEC J-STD-033). For more than one
year, shelf life and storage are similar to parts with Tin
Lead Finish.
Substrate:
Depending upon the particular component,
the circuit material has an x and y coefficient of thermal
expansion of between 17 and 25 ppm/°C. This
coefficient minimizes solder joint stresses due to similar
expansion rates of most commonly used board
substrates such as RF35, RO4003, FR4, polyimide and
G-10 materials. Mounting to “hard” substrates (alumina
etc.) is possible depending upon operational temperature
requirements. The solder surfaces of the coupler are all
copper plated with either an immersion tin or tin-lead
exterior finish.
Solder Paste:
All conventional solder paste formulations
will work well with Anaren’s Xinger surface mount
components. Solder paste can be applied with stencils or
syringe dispensers. An example of a stenciled solder
paste deposit is shown in Figure 2. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.


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