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XEC24P3-30G Scheda tecnica(PDF) 14 Page - Anaren Microwave |
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XEC24P3-30G Scheda tecnica(HTML) 14 Page - Anaren Microwave |
14 / 19 page USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Available on Tape and Reel for Pick and Place Manufacturing. Model XEC24P3-30G Rev B Mounting In order for Xinger surface mount couplers to work optimally, there must be 50Ω transmission lines leading to and from all of the RF ports. Also, there must be a very good ground plane underneath the part to ensure proper electrical performance. If either of these two conditions is not satisfied, electrical performance may not meet published specifications. Overall ground is improved if a dense population of plated through holes connect the top and bottom ground layers of the PCB. This minimizes ground inductance and improves ground continuity. All of the Xinger hybrid and directional couplers are constructed from ceramic filled PTFE composites which possess excellent electrical and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17-25 ppm/ oC. When a surface mount coupler is mounted to a printed circuit board, the primary concerns are; ensuring the RF pads of the device are in contact with the circuit trace of the PCB and insuring the ground plane of neither the component nor the PCB is in contact with the RF signal. Mounting Footprint .170 [4.32] .120 [3.05] .034 [0.86] 4x 50 Transmission Line Multiple plated thru holes to ground To ensure proper electrical and thermal performance there must be a ground plane with 100% solder connection underneath the part orientated as shown with text facing up Dimensions are in Inches [Millimeters] XEC24P3-30G Mounting Footprint Coupler Mounting Process The process for assembling this component is a conventional surface mount process as shown in Figure 1. This process is conducive to both low and high volume usage. Figure 1: Surface Mounting Process Steps Storage of Components: The Xinger Couplers are available in ENIG finish. Dry packaging will be effective for a least one year if stored at less than 40 °C and 90% RH (see IPC/JEDEC J-STD-033). For more than one year, shelf life and storage are similar to parts with Tin Lead Finish. Substrate: Depending upon the particular component, the circuit material has an x and y coefficient of thermal expansion of between 17 and 25 ppm/°C. This coefficient minimizes solder joint stresses due to similar expansion rates of most commonly used board substrates such as RF35, RO4003, FR4, polyimide and G-10 materials. Mounting to “hard” substrates (alumina etc.) is possible depending upon operational temperature requirements. The solder surfaces of the coupler are all copper plated with either an immersion tin or tin-lead exterior finish. Solder Paste: All conventional solder paste formulations will work well with Anaren’s Xinger surface mount components. Solder paste can be applied with stencils or syringe dispensers. An example of a stenciled solder paste deposit is shown in Figure 2. As shown in the figure solder paste is applied to the four RF pads and the entire ground plane underneath the body of the part. |
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