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LM3557 Scheda tecnica(PDF) 2 Page - National Semiconductor (TI) |
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LM3557 Scheda tecnica(HTML) 2 Page - National Semiconductor (TI) |
2 / 11 page Connection Diagram Top View 20131602 8-Lead Thin Leadless Leadframe Package See NS Package Number SDA08A Ordering Information Order Number Package Marking Supplied As LM3557SD-2 L147B 1k Units, Tape and Reel LM3557SDX-2 L147B 4.5k Units, Tape and Reel Pin Description Pin # Name Description 1 Sw1 Drain Connection of the Internal Power Field Effect Transistor (FET) Switch (Figure 2: N1) 2V IN Input Voltage Connection 3 NC No Connection 4 En Device Enable Connection 5 Ovp Over-Voltage Protection Input Connection 6 Fb Feedback Voltage Connection 7 Sw2 Drain Connection of an Internal Field Effect Transistor (FET) Switch (Figure 2: N2) 8 Gnd Ground Connection DAP DAP Die Attach Pad (DAP), must be soldered to the printed circuit board’s ground plane for enhanced thermal dissipation www.national.com 2 |
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