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MC100EP210SFAR2G Scheda tecnica(PDF) 4 Page - ON Semiconductor |
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MC100EP210SFAR2G Scheda tecnica(HTML) 4 Page - ON Semiconductor |
4 / 8 page MC100EP210S http://onsemi.com 4 Table 4. DC CHARACTERISTICS VCC = 2.5 V, VEE = 0 V (Note 2) −40°C 25°C 85°C Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit IEE Power Supply Current 150 200 150 200 150 200 mA VOH Output HIGH Voltage (Note 3) 1250 1400 1550 1250 1400 1550 1250 1400 1550 mV VOL Output LOW Voltage (Note 3) 800 950 1100 800 950 1100 800 950 1100 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 4) 1.2 2.5 1.2 2.5 1.2 2.5 V RT Internal Termination Resistor 43 57 43 50 57 43 57 W IIH Input HIGH Current 150 150 150 mA IIL Input LOW Current CLK CLK −150 −150 150 150 −150 −150 150 150 −150 −150 150 150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Input and output parameters vary 1:1 with VCC. 3. All loading with 100 W across LVDS differential outputs. 4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 5. AC CHARACTERISTICS VCC = 2.375 to 2.625 V, VEE = 0 V (Note 5) −40°C 25°C 85°C Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit fmaxLVDS/ LVPECL Maximum Frequency (See Figure 2. Fmax/JITTER) > 1 > 1 > 1 GHz tPLH tPHL Propagation Delay 425 525 625 450 550 650 475 575 675 ps tskew Within−Device Skew (Note 6) Device−to−Device Skew (Note 7) Duty Cycle Skew (Note 8) 20 85 80 25 160 100 20 85 80 25 160 100 20 85 80 35 160 100 ps tJITTER RMS Random Clock Jitter 0.2 < 1 0.2 < 1 0.2 < 1 ps VPP Minimum Input Swing 150 800 1200 150 800 1200 150 800 1200 mV tr/tf Output Rise/Fall Time (20%−80%) 50 130 200 75 150 225 80 160 230 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Measured with 400 mV source, 50% duty cycle clock source. All loading with 100 W across differential outputs. 6. Skew is measured between outputs under identical transitions of similar paths through a device. 7. Device−to−Device skew for identical transitions at identical VCC levels. 8. Duty cycle skew guaranteed only for differential operation measured from the cross point of the input to the cross point of the output. |
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