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TPA112 Scheda tecnica(PDF) 2 Page - Texas Instruments |
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TPA112 Scheda tecnica(HTML) 2 Page - Texas Instruments |
2 / 32 page www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATING TABLE TPA112 SLOS212E – AUGUST 1998 – REVISED JUNE 2004 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OPTIONS PACKAGED DEVICES MSOP TA SMALL OUTLINE(1) MSOP(1) SYMBOLIZATION (D) (DGN) –40 °C to 85°C TPA112D TPA112DGN TI AAD (1) The D and DGN packages are available in left-ended tape and reel only (e.g., TPA112DR, TPA112DGNR). Terminal Functions TERMINAL I/O DESCRIPTION NAME NO. GND 4 I GND is the ground connection. IN1- 2 I IN1- is the inverting input for channel 1. IN1+ 3 I IN1+ is the noninverting input for channel 1. IN2- 6 I IN2- is the inverting input for channel 2. IN2+ 5 I IN2+ is the noninverting input for channel 2. VDD 8 I VDD is the supply voltage terminal. VO1 1 O VO1 is the audio output for channel 1. VO2 7 O VO2 is the audio output for channel 2. over operating free-air temperature range (unless otherwise noted)(1) UNIT VDD Supply voltage 6 V VI Differential input voltage –0.3 V to VDD + 0.3 V II Input current ±2.5 µA IO Output current ±250 mA Continuous total power dissipation Internally llimited TJ Operating junction temperature range –40 °C to 150°C Tstg Storage temperature range –65 °C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C (1) Stresses beyond those listed under "absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C PACKAGE POWER RATING ABOVE TA = 25°C POWER RATING POWER RATING D 725 mW 5.8 mW/ °C 464 mW 377 mW DGN 2.14 W(1) 17.1 mW/ °C 1.37 W 1.11 W (1) See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report (SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB layout based on the information in the section entitled Texas Instruments Recommended Board for PowerPAD, of that document. 2 |
Codice articolo simile - TPA112_16 |
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Descrizione simile - TPA112_16 |
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