4

TLV733P

SBVS235B – OCTOBER 2014 – REVISED NOVEMBER 2015

www.ti.com

Product Folder Links: TLV733P

Submit Documentation Feedback

Copyright © 2014–2015, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted); all voltages are with respect to GND

(1)

MIN

MAX

UNIT

Voltage

–0.3

6.0

V

–0.3

–0.3

3.6

Current

Internally limited

A

Output short-circuit duration

Indefinite

Temperature

–40

150

°C

–65

160

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±500

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

1.4

5.5

V

1.0

3.3

V

0

300

mA

0

V

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

TLV733P

UNIT

DQN (X2SON)

DBV (SOT-23)

4 PINS

5 PINS

Junction-to-ambient thermal resistance

218.6

228.4

°C/W

Junction-to-case (top) thermal resistance

164.8

151.5

°C/W

Junction-to-board thermal resistance

164.9

55.8

°C/W

Junction-to-top characterization parameter

5.6

31.4

°C/W

Junction-to-board characterization parameter

163.9

54.8

°C/W

Junction-to-case (bottom) thermal resistance

131.4

N/A

°C/W