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MCRF200IWFQ23 Scheda tecnica(PDF) 11 Page - Microchip Technology |
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MCRF200IWFQ23 Scheda tecnica(HTML) 11 Page - Microchip Technology |
11 / 24 page 2003 Microchip Technology Inc. DS21219H-page 11 MCRF200 5.0 MECHANICAL SPECIFICATIONS FOR DIE AND WAFER FIGURE 5-1: DIE PLOT TABLE 5-1: PAD COORDINATES ( µm) TABLE 5-2: PAD FUNCTION TABLE VB VA VSS VCC RESET I/O Device Test Only Passivation Openings Pad Name Pad Width Pad Height Pad Center X Pad Center Y VA 90.0 90.0 427.50 -734.17 VB 90.0 90.0 -408.60 -734.17 Note 1: All coordinates are referenced from the center of the die. 2: Die size: 1.1215 mm x 1.7384 mm 44.15 mils x 68.44 mils Name Function VA Antenna Coil connection VB VSS For device test only Do Not Connect to Antenna VCC RESET I/O |
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