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AD1981B Scheda tecnica(PDF) 7 Page - Analog Devices |
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AD1981B Scheda tecnica(HTML) 7 Page - Analog Devices |
7 / 28 page REV. B AD1981B –7– PIN CONFIGURATION 48-Lead LQFP 1 2 3 4 5 6 7 8 9 10 11 12 DVDD1 XTL_IN XTL_OUT DVSS1 SDATA_OUT BIT_CLK DVSS2 SDATA_IN DVDD2 SYNC RESET NC 36 35 34 33 32 31 30 29 28 27 26 25 LINE_OUT_R LINE_OUT_L AVDD4 AVSS4 AFILT4 AFILT3 AFILT2 AFILT1 VREFOUT VREF AVSS1 AVDD1 AD1981B TOP VIEW (Not to Scale) NC = NO CONNECT ABSOLUTE MAXIMUM RATINGS * (TA = 25 °C, unless otherwise noted.) Power Supplies Digital (DVDD) . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.6 V Analog (AVDD) . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.0 V Input Current (Except Supply Pins) . . . . . . . . . . . . . . ±10 mA Signals Pins Digital Input Voltage . . . . . . . . . . . . . –0.3 V to DVDD + 0.3 V Analog Input Voltage . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V Ambient Temperature Range (Operating) . . . . . . . 0 °C to 70°C *Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ENVIRONMENTAL CONDITIONS * Ambient Temperature Rating (LQFP Package) TCASE = Case Temperature in °C PD = Power Dissipation in W JA Thermal Resistance (Junction to Ambient) JC Thermal Resistance (Junction to Case) ORDERING GUIDE Model Temperature Range Package Description Package Option 1 AD1981BJST 0 °C to 70°C 48-Lead LQFP (Tray) ST-48 AD1981BJST-REEL 0 °C to 70°C 48-Lead LQFP (Reel) ST-48 AD1981BJSTZ 2 0 °C to 70°C 48-Lead LQFP (Tray) ST-48 AD1981BJSTZ-REEL 2 0 °C to 70°C 48-Lead LQFP (Reel) ST-48 1ST = Low Profile Quad Flatpack. 2The AD1981BJSTZ is a lead-free environmentally friendly product. It is manufactured using the most up-to-date materials and processes. The coating on the leads of each device is 100% pure tin electroplate. The device is suitable for lead-free applications and is able to withstand surface-mount soldering at up to 255 °C (± 5°C). In addition, it is backward compatible with conventional tin-lead soldering processes. This means that the electroplated tin coating can be soldered with tin-lead solder pastes at reflow temperatures of 220 °C to 235°C. Package JA JC LQFP 50.1 °C/W 17.8 °C/W *All measurements per EIA-JESD51 with 2S2P test board per EIA-JESD51-7 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD1981B features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
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