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SM6004 Scheda tecnica(PDF) 3 Page - Solid State Optronic |
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SM6004 Scheda tecnica(HTML) 3 Page - Solid State Optronic |
3 / 7 page © 2013 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4600 Page 3 of 7 SM6004 /H/S/TR Rev 2.00 (11/12/2013) 001714 SM6004 Optically Coupled MOSFET Driver w/Discharge Circuit Process Step Description Parameter A Preheat Start Temperature (ºC) 150ºC B Preheat Finish Temperature (ºC) 180ºC C Preheat Time (s) 90 - 120s D Melting Temperature (ºC) 230ºC E Time above Melting Temperature (s) 30s F Peak Temperature, at Terminal (ºC) 260ºC G Dwell Time at Peak Temperature (s) 10s H Cool-down (ºC/s) <6ºC/s SM6004 Solder Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device package should not exceed 250ºC: A B C D F E G H (2) Wave Solder: (3) Hand Solder: Maximum Temperature: 260ºC (at terminal) Maximum Time: 10s Pre-heating: 100 - 150ºC (30 - 90s) Single Occurrence Maximum Temperature: 350ºC (at tip of soldering iron) Maximum Time: 3s Single Occurrence Figure 1 |
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