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LMZ23608 Scheda tecnica(PDF) 4 Page - Texas Instruments

Il numero della parte LMZ23608
Spiegazioni elettronici  8A SIMPLE SWITCHER Power Module
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Produttore elettronici  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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LMZ23608
SNVS708G – MARCH 2011 – REVISED AUGUST 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2) (3)
MIN
MAX
UNIT
VIN to PGND
–0.3
40
V
EN, SYNC to AGND
–0.3
5.5
V
SS, FB, SH to AGND
–0.3
2.5
V
AGND to PGND
–0.3
0.3
V
Junction temperature
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
For soldering specifications: see product folder at www.ti.com and SNOA549
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
MAX
UNIT
VIN
6
36
V
EN, SYNC
0
5
V
Operation junction temperature
−40
125
°C
6.4 Thermal Information
LMZ23608
THERMAL METRIC(1)
NDY
UNIT
11 PINS
Natural Convection
9.9
RθJA
Junction-to-ambient thermal resistance(2)
225 LFPM
6.8
°C/W
500 LFPM
5.2
RθJC(top)
Junction-to-case (top) thermal resistance
1.0
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2)
Theta JA measured on a 3.0-in x 3.5-in 4-layer board, with 2-oz. copper on outer layers and 1-oz. copper on inner layers, two hundred
and ten thermal vias, and 2-W power dissipation. Refer to evaluation board application note layout diagrams.
4
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Copyright © 2011–2015, Texas Instruments Incorporated
Product Folder Links: LMZ23608


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