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UC1707-SP Scheda tecnica(PDF) 4 Page - Texas Instruments |
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UC1707-SP Scheda tecnica(HTML) 4 Page - Texas Instruments |
4 / 20 page 4 UC1707-SP SLUSAG0A – MARCH 2011 – REVISED MARCH 2016 www.ti.com Product Folder Links: UC1707-SP Submit Documentation Feedback Copyright © 2011–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the four ground pins which must be connected together. All currents are positive into, negative out of the specified terminal. Digital drive can exceed 5.5 V if input current is limited to 10 mA. Consult packaging section of datasheet for thermal limitations and considerations of package. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN Supply voltage 40 V VC Collector supply voltage 40 V Digital inputs(2) 5.5 V Output current (each output, source or sink) steady-state ±500 mA Peak transient ±1 A Capacitive discharge energy 15 mJ Analog stop inputs VIN TJ Operating virtual-junction temperature 150 °C Power dissipation at Tcase = 25°C (2) J package 13 W W package 15 W FK package 13 W Lead temperature (soldering, 10 s) 300 °C Operating temperature –55 125 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Supply voltage 5 12 38 V VC Supply voltage 5 12 38 V (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) UC1707-SP UNIT J (CDIP) FK (LCCC) W (CFP) 16 PINS 20 PINS 16 PINS RθJC(top) Junction-to-case (top) thermal resistance 36 31.8 53.6 °C/W RθJB Junction-to-board thermal resistance 55.2 31.3 105 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 9.5 2.8 4.2 °C/W 6.5 Electrical Characteristics Unless otherwise stated, these specifications apply for TA = –55°C to 125°C; VIN = VC = 20 V. TA = TJ. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIN Supply current VIN = 40 V 12 15 mA |
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