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UC1707-SP Scheda tecnica(PDF) 4 Page - Texas Instruments

Il numero della parte UC1707-SP
Spiegazioni elettronici  Dual-Channel Power Driver
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Homepage  http://www.ti.com
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UC1707-SP
SLUSAG0A – MARCH 2011 – REVISED MARCH 2016
www.ti.com
Product Folder Links: UC1707-SP
Submit Documentation Feedback
Copyright © 2011–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to the four ground pins which must be connected together. All currents are positive into, negative out of the
specified terminal. Digital drive can exceed 5.5 V if input current is limited to 10 mA. Consult packaging section of datasheet for thermal
limitations and considerations of package.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VIN
Supply voltage
40
V
VC
Collector supply voltage
40
V
Digital inputs(2)
5.5
V
Output current (each output, source or sink) steady-state
±500
mA
Peak transient
±1
A
Capacitive discharge energy
15
mJ
Analog stop inputs
VIN
TJ
Operating virtual-junction temperature
150
°C
Power dissipation at Tcase = 25°C
(2)
J package
13
W
W package
15
W
FK package
13
W
Lead temperature (soldering, 10 s)
300
°C
Operating temperature
–55
125
°C
Tstg
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIN
Supply voltage
5
12
38
V
VC
Supply voltage
5
12
38
V
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1)
UC1707-SP
UNIT
J (CDIP)
FK (LCCC)
W (CFP)
16 PINS
20 PINS
16 PINS
RθJC(top)
Junction-to-case (top) thermal resistance
36
31.8
53.6
°C/W
RθJB
Junction-to-board thermal resistance
55.2
31.3
105
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
9.5
2.8
4.2
°C/W
6.5 Electrical Characteristics
Unless otherwise stated, these specifications apply for TA = –55°C to 125°C; VIN = VC = 20 V. TA = TJ.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIN
Supply current
VIN = 40 V
12
15
mA


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