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SM470R1B1M-HT Scheda tecnica(PDF) 10 Page - Texas Instruments |
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SM470R1B1M-HT Scheda tecnica(HTML) 10 Page - Texas Instruments |
10 / 79 page SM470R1B1M-HT SPNS155I – SEPTEMBER 2009 – REVISED JUNE 2015 www.ti.com 4 Bare Die 4.1 Bare Die Information DIE PAD DIE DIE PAD BACKSIDE BACKSIDE DIE SIZE DIE PAD SIZE COORDINATES(1) THICKNESS COMPOSITION FINISH POTENTIAL 208.858 × 211.890 mils/ Silicon with 65.1 × 65.1 (µm) See Table 4-1 11 mils AlCu Ground 5304.99 × 5382.01 µm backgrind (1) Pads 12, 22, 26, 136, 143, 146, 149 and 152 are test pads, no connections required. It is highly recommended to leave them open. 10 Bare Die Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: SM470R1B1M-HT |
Codice articolo simile - SM470R1B1M-HT_15 |
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Descrizione simile - SM470R1B1M-HT_15 |
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