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TL062BCDR Scheda tecnica(PDF) 5 Page - Texas Instruments |
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TL062BCDR Scheda tecnica(HTML) 5 Page - Texas Instruments |
5 / 52 page TL061, TL061A, TL061B TL062, TL062A, TL062B, TL064, TL064A, TL064B www.ti.com SLOS078L – NOVEMBER 1978 – REVISED MAY 2015 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- 2000 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC+ Supply voltage 5 15 V VCC– Supply voltage –5 –15 V VCM Common-mode voltage VCC– + 4 VCC+ – 4 V TL06xM –55 125 TL06xQ –40 125 TA Ambient temperature °C TL06xI –40 85 TL06xC 0 70 6.4 Thermal Information - 8 Pins TL06xx THERMAL METRIC(1) D (SOIC) P (PDIP) PS (SO) PW (TSSOP) JG (CDIP) UNIT 8 PINS 8 PINS 8 PINS 8 PINS 8 PINS RθJ Junction-to-ambient thermal 97 85 95 149 — °C/W A resistance(2)(3) RθJ Junction-to-case (top) thermal C(to — — — — 14.5 °C/W resistance(4)(5) p) (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability. (3) The package thermal impedance is calculated in accordance with JESD 51-7. (4) Maximum power dissipation is a function of TJ(max), RθJC, and TC. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TC) / RθJC. Operating at the absolute maximum TJ of 150°C can affect reliability. (5) The package thermal impedance is calculated in accordance with MIL-STD-883. 6.5 Thermal Information - 14 Pins TL06xx D (SOIC) N (PDIP) NS (SO) PS (SO) PW J (CDIP) W (CFP) THERMAL METRIC(1) UNIT (TSSOP) 14 PINS 14 PINS 14 PINS 8 PINS 14 PINS 14 PINS 14 PINS RθJ Junction-to-ambient thermal 113 86 80 76 95 — — °C/W A resistance(2)(3) RθJ Junction-to-case (top) thermal C(to — — — — — 15.05 14.65 °C/W resistance(2)(3) p) (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) Maximum power dissipation is a function of TJ(max), RθJC, and TC. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TC) / RθJC. Operating at the absolute maximum TJ of 150°C can affect reliability. (3) The package thermal impedance is calculated in accordance with MIL-STD-883. Copyright © 1978–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TL061 TL061A TL061B TL062 TL062A TL062B TL064 TL064A TL064B |
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