LM13700

SNOSBW2F – NOVEMBER 1999 – REVISED NOVEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

V

DC input voltage

V

Differential input voltage

±5

V

2

mA

2

mA

20

mA

570

mW

Output short circuit duration

Continuous

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Buffer output current should be limited so as to not exceed package dissipation.

(3)

For operation at ambient temperatures above 25°C, the device must be derated based on a 150°C maximum junction temperature and a

thermal resistance, junction to ambient, as follows: LM13700N, 90°C/W; LM13700M, 110°C/W.

6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

V+ (single-supply configuration)

9.5

32

V

V+ (dual-supply configuration)

4.75

16

V

V– (dual-supply configuration)

–16

–4.75

V

LM13700N

0

70

°C

6.3 Thermal Information

LM13700

D (SOIC)

NFG (PDIP)

UNIT

16 PINS

16 PINS

Junction-to-ambient thermal resistance

83.0

43.8

°C/W

Junction-to-case (top) thermal resistance

44.0

34.9

°C/W

Junction-to-board thermal resistance

40.5

28.3

°C/W

Junction-to-top characterization parameter

11.5

19.1

°C/W

Junction-to-board characterization parameter

40.2

28.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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