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TMP175AQDGKRQ1 Scheda tecnica(PDF) 4 Page - Texas Instruments

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Il numero della parte TMP175AQDGKRQ1
Spiegazioni elettronici  TMPx75-Q1 Automotive Grade Temperature Sensor With I2C and SMBus Interface in Industry-Standard LM75 Form Factor and Pinout
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Produttore elettronici  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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TMP175-Q1, TMP75-Q1
SBOS759 – NOVEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Power supply, V+
7
V
Input voltage(2)
–0.5
7
V
Input current
10
mA
Operating temperature
–55
127
°C
Junction temperature, TJ
150
°C
Storage temperature, Tstg
–60
130
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Input voltage rating applies to all TMP175-Q1 and TMP75-Q1 input voltages.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2500
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
±1000
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply voltage
2.7
5.5
V
Operating free-air temperature, TA
–40
125
°C
6.4 Thermal Information
TMP175-Q1, TMP75-Q1
THERMAL METRIC(1)
DGK (SOIC), D (VSSOP)
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
185
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
76.1
°C/W
RθJB
Junction-to-board thermal resistance
106.4
°C/W
ψJT
Junction-to-top characterization parameter
14.1
°C/W
ψJB
Junction-to-board characterization parameter
104.8
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: TMP175-Q1 TMP75-Q1


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