TMP175, TMP75

SBOS288L – JANUARY 2004 – REVISED DECEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Power supply, V+

7

V

–0.5

7

V

Input current

10

mA

Operating temperature

–55

127

°C

150

°C

–60

130

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input voltage rating applies to all TMP175 and TMP75 input voltages.

6.2 ESD Ratings

VALUE

UNIT

±4000

Electrostatic discharge

±1000

V

Machine model (MM)

±300

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2.7

5.5

V

–40

125

°C

6.4 Thermal Information

TMP175, TMP75

DGK (SOIC),

UNIT

D (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

185

°C/W

Junction-to-case (top) thermal resistance

76.1

°C/W

Junction-to-board thermal resistance

106.4

°C/W

Junction-to-top characterization parameter

14.1

°C/W

Junction-to-board characterization parameter

104.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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