SFR16S, SFR25, SFR25H

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Vishay BCcomponents

Revision: 28-Oct-15

7

Document Number: 28722

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

TESTS PROCEDURES AND REQUIREMENTS

All tests are carried out in accordance with the following

specifications:

• EN 60115-1, generic specification (includes tests)

The test and requirements table contains only the most

important tests. For the full test schedule refer to the

documents listed above.

The tests are carried out in accordance with IEC 60068-2-xx

test method and under standard atmospheric conditions in

accordance with IEC 60068-1, 5.3.





Unless otherwise specified the following values apply:

• Temperature: 15 °C to 35 °C

• Relative humidity: 45 % to 75 %

• Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).

For performing some of the tests, the components are

mounted on a test board in accordance with IEC 60115-1,

4.31. In test procedures and requirements table, only the

tests and requirements are listed with reference to the

relevant clauses of IEC 60115-1 and IEC 60068-2-xx test

methods. A short description of the test procedure is also

given.

TEST PROCEDURES AND REQUIREMENTS

IEC

60115-1

CLAUSE

IEC

60068-2

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS PERMISSIBLE CHANGE (

R

4.5

-

Resistance

-

± 5 %; ± 1 %

4.8

-

Temperature

coefficient

At (20 / -55 / 20) °C

and (20 / 155 / 20) °C

± 250 ppm/K; ± 100 ppm/K

4.12

-

Noise

IEC 60195

< 68 k



68 k

 to

100 k



> 100 k

 to

1 M



> 1 M



SFR16S

≤ 0.1 μV/V

≤ 0.5 μV/V

≤ 1.5 μV/V

≤ 1.5 μV/V

SFR25,



SFR25H

≤ 0.1 μV/V

≤ 0.1 μV/V

≤ 0.1 μV/V

≤ 1.5 μV/V

4.13

-

Short time

overload

Room temperature;

SFR16S,



SFR25

± (0.25 % R + 0.05

)

SFR25H

± (1 % R + 0.05

)

4.16

21 (Ua1)

21 (Ub)

21 (Uc)

Robustness of

terminations

Tensile, bending, and torsion

± (0.25 % R + 0.05

)

4.17

20 (Ta)

Solderability

at +235 °C; 2 s;

solder bath method;

SnPb40

Good tinning (≥ 95 % covered); no damage

at +245 °C; 3 s;

solder bath method;

SnAg3Cu0.5

4.18

20 (Tb)

Resistance to

soldering heat

Unmounted components

(260 ± 5) °C; (10 ± 1) s

± (0.25 % R + 0.05

)

4.19

14 (Na)

Rapid change of

temperature

30 min at -55 °C and

30 min at +155 °C;

5 cycles

± (0.25 % R + 0.05

)

4.20

29 (Eb)

Bump

3 x 1500 bumps in 3 directions;

40 g

± (0.25 % R + 0.05

); no damage

4.22

6 (Fc)

Vibration

10 sweep cycles per direction;

10 Hz to 2000 Hz

± (0.25 % R + 0.05

); no damage

4.23

Climatic

sequence:

4.23.2

2 (Ba)

Dry heat

155 °C; 16 h

4.23.3

30 (Db)

Damp heat,

cyclic

55 °C; 24 h;

90 % to 100 % RH; 1 cycle

4.23.4

1 (Aa)

Cold

-55 °C; 2 h

4.23.5

13 (M)

Low air pressure

8.5 kPa; 2 h; 15 °C to 35 °C

4.23.6

30 (Db)

Damp heat,

cyclic

55 °C; 5 days;

95 % to 100 % RH; 5 cycles

SFR16S,



SFR25,



SFR25H

± (1 % R + 0.05

); no visible damage

± (1 % R + 0.05

); no visible damage

± 2 % R; no visible damage

4.23.7

DC load

apply rated power for 1 min