LMZ14201EXT

SNVS664H – JUNE 2010 – REVISED OCTOBER 2015

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6.3 Recommended Operating Conditions

MIN

MAX

UNIT

6

42

V

EN

0

6.5

V

Operation Junction Temperature

−55

125

°C

6.4 Thermal Information

LMZ14201EXT

NDW (TO-PMOD)

UNIT

7 PINS

4-layer JEDEC Printed-Circuit-Board, 100 vias, No air flow

19.3

Junction-to-ambient thermal

°C/W

resistance

2-layer JEDEC Printed-Circuit-Board, No air flow

21.5

Junction-to-case (top)

No air flow

1.9

°C/W

thermal resistance

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Refer to Figure 41.

6.5 Electrical Characteristics

to +125°C. Minimum and Maximum limits are ensured through test, design or statistical correlation. Typical values represent

PARAMETER

TEST CONDITIONS

UNIT

SYSTEM PARAMETERS

1.18

EN threshold trip point

V

1.1

1.26

range of –55°C to 125°C

EN threshold hysteresis

90

mV

SOFT-START

8

SS source current

µA

4.9

11

range of –55°C to 125°C

SS discharge current

-200

µA

CURRENT LIMIT

1.95

Current limit threshold

DC average

A

1.4

3

range of –55°C to 125°C

(1)

Minimum and Maximum limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through

correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).

(2)

Typical numbers are at 25°C and represent the most likely parametric norm.

(3)

EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007. See AN-2024 LMZ1420x / LMZ1200x Evaluation Board, SNVA422 and layout

for information on device under test.

4

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