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LM3280 Scheda tecnica(PDF) 3 Page - Texas Instruments |
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LM3280 Scheda tecnica(HTML) 3 Page - Texas Instruments |
3 / 27 page LM3280 www.ti.com SNOSAU4B – OCTOBER 2006 – REVISED FEBRUARY 2013 Absolute Maximum Ratings (1) (2) SVIN, PVIN to SGND −0.2V to +6.0V PGND to SGND −0.2V to +0.2V ENs, FB, BYP, VCON (SGND −0.2V) to (SVIN +0.2V) w/6.0V max SW, BYPOUT (PGND −0.2V) to (PVIN +0.2V) w/6.0V max PVIN to SVIN −0.2V to +0.2V Continuous Power Dissipation (3) Internally Limited Junction Temperature (TJ-MAX) +150°C Storage Temperature Range −65°C to +150°C Maximum Lead Temperature (Soldering, 10 sec.) +260°C ESD Rating (4) Human Body Model 2k V Machine Model 200 V (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pins. (3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and disengages at TJ = 125°C (typ.). (4) The Human body model is a 100pF capacitor discharged through a 1.5k Ω resistor into each pin. (MIL-STD-883 3015.7) The machine model is a 200pF capacitor discharged directly into each pin. National Semiconductor recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper ESD handling techniques can result in damage. Operating Ratings (1) (2) Input Voltage Range 2.7V to 5.5V Recommended Load Current PWM Mode: 0mA to 300mA Bypass Mode: 0mA to 500mA LDO: 0mA to 20mA Junction Temperature (TJ) Range −30°C to +125°C Ambient Temperature (TA) Range −30°C to +85°C (3) (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) Shutdown current includes leakage current of PFET and Bypass FET. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). Thermal Properties Junction-to-Ambient Thermal Resistance ( θJA), DSBGA Package (1) 48 °C/W (1) Junction-to-ambient thermal resistance ( θJA) is taken from thermal measurements, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. A 1" x 1", 4 layer, 1.5oz. Cu board was used for the measurements. The θJA, which is performed under the 4 layer cellphone board condition, is 86°C/W. Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3280 |
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