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LM3280 Scheda tecnica(PDF) 3 Page - Texas Instruments

Il numero della parte LM3280
Spiegazioni elettronici  Adjustable Step-Down DC-DC Converter and 3 LDOs for RF Power Management
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
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LM3280 Scheda tecnica(HTML) 3 Page - Texas Instruments

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LM3280
www.ti.com
SNOSAU4B – OCTOBER 2006 – REVISED FEBRUARY 2013
Absolute Maximum Ratings
(1) (2)
SVIN, PVIN to SGND
−0.2V to +6.0V
PGND to SGND
−0.2V to +0.2V
ENs, FB, BYP, VCON
(SGND
−0.2V)
to (SVIN +0.2V)
w/6.0V max
SW, BYPOUT
(PGND
−0.2V)
to (PVIN +0.2V)
w/6.0V max
PVIN to SVIN
−0.2V to +0.2V
Continuous Power Dissipation
(3)
Internally Limited
Junction Temperature (TJ-MAX)
+150°C
Storage Temperature Range
−65°C to +150°C
Maximum Lead Temperature
(Soldering, 10 sec.)
+260°C
ESD Rating (4)
Human Body Model
2k V
Machine Model
200 V
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2)
All voltages are with respect to the potential at the GND pins.
(3)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and
disengages at TJ = 125°C (typ.).
(4)
The Human body model is a 100pF capacitor discharged through a 1.5k
Ω resistor into each pin. (MIL-STD-883 3015.7) The machine
model is a 200pF capacitor discharged directly into each pin. National Semiconductor recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe proper ESD handling techniques can result in damage.
Operating Ratings
(1) (2)
Input Voltage Range
2.7V to 5.5V
Recommended Load Current
PWM Mode:
0mA to 300mA
Bypass Mode:
0mA to 500mA
LDO:
0mA to 20mA
Junction Temperature (TJ) Range
−30°C to +125°C
Ambient Temperature (TA) Range
−30°C to +85°C
(3)
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2)
Shutdown current includes leakage current of PFET and Bypass FET.
(3)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
Thermal Properties
Junction-to-Ambient Thermal Resistance (
θJA), DSBGA Package
(1)
48 °C/W
(1)
Junction-to-ambient thermal resistance (
θJA) is taken from thermal measurements, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7. A 1" x 1", 4 layer, 1.5oz. Cu board was used for the measurements. The
θJA, which is
performed under the 4 layer cellphone board condition, is 86°C/W.
Copyright © 2006–2013, Texas Instruments Incorporated
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