Motore di ricerca datesheet componenti elettronici |
|
UC1715-SP Scheda tecnica(PDF) 4 Page - Texas Instruments |
|
UC1715-SP Scheda tecnica(HTML) 4 Page - Texas Instruments |
4 / 14 page UC1715-SP SLUSAU8 – MAY 2013 www.ti.com THERMAL INFORMATION UC1715-SP THERMAL METRIC(1) W UNITS 16 PINS θJA Junction-to-ambient thermal resistance(2) 72.9 θJC Junction-to-case thermal resistance(3) 8.25 °C/W θJB Junction-to-board thermal resistance(4) 43.4 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. 4 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: UC1715-SP |
Codice articolo simile - UC1715-SP_15 |
|
Descrizione simile - UC1715-SP_15 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEETIT.COM |
Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |