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74HC_HCT157 Scheda tecnica(PDF) 3 Page - NXP Semiconductors |
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74HC_HCT157 Scheda tecnica(HTML) 3 Page - NXP Semiconductors |
3 / 19 page 74HC_HCT157 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 21 January 2015 3 of 19 NXP Semiconductors 74HC157; 74HCT157 Quad 2-input multiplexer 5. Pinning information 5.1 Pinning Fig 3. Logic symbol Fig 4. IEC logic symbol (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Fig 5. Pin configuration DIP16, SO16, (T)SSOP16 Fig 6. Pin configuration DHVQFN16 |
Codice articolo simile - 74HC_HCT157_15 |
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Descrizione simile - 74HC_HCT157_15 |
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