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IRF330 Scheda tecnica(PDF) 1 Page - International Rectifier

Il numero della parte IRF330
Spiegazioni elettronici  TRANSISTORS N-CHANNEL(Vdss=400V, Rds(on)=1.00ohm, Id=5.5A)
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Produttore elettronici  IRF [International Rectifier]
Homepage  http://www.irf.com
Logo IRF - International Rectifier

IRF330 Scheda tecnica(HTML) 1 Page - International Rectifier

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Absolute Maximum Ratings
Parameter
Units
ID @ VGS = 10V, TC = 25°C
Continuous Drain Current
5.5
ID @ VGS = 10V, TC = 100°C
Continuous Drain Current
3.5
IDM
Pulsed Drain Current ➀
22
PD @ TC = 25°C
Max. Power Dissipation
7 5
W
Linear Derating Factor
0.60
W/°C
VGS
Gate-to-Source Voltage
±20
V
EAS
Single Pulse Avalanche Energy ➁
1.7
mJ
IAR
Avalanche Current ➀
5.5
A
EAR
Repetitive Avalanche Energy ➀
—mJ
dv/dt
Peak Diode Recovery dv/dt ➂
4.0
V/ns
T J
Operating Junction
-55 to 150
TSTG
Storage Temperature Range
Lead Temperature
300 (0.063 in. (1.6mm) from case for 10s)
Weight
11.5 (typical)
g
PD - 90335F
o C
A
01/22/01
www.irf.com
1
Product Summary
Part Number
BVDSS
RDS(on)
ID
IRF330
400V
1.00
5.5A
For footnotes refer to the last page
REPETITIVE AVALANCHE AND dv/dt RATED
JANTX2N6760
HEXFET
TRANSISTORS
JANTXV2N6760
THRU-HOLE (TO-204AA/AE)
[REF:MIL-PRF-19500/542]
IRF330
400V, N-CHANNEL
The HEXFETtechnology is the key to International
Rectifier’s advanced line of power MOSFET transistors.
The efficient geometry and unique processing of this latest
“State of the Art” design achieves: very low on-state resis-
tance combined with high transconductance; superior re-
verse energy and diode recovery dv/dt capability.
The HEXFET transistors also feature all of the well estab-
lished advantages of MOSFETs such as voltage control,
very fast switching, ease of paralleling and temperature
stability of the electrical parameters.
They are well suited for applications such as switching
power supplies, motor controls, inverters, choppers, audio
amplifiers and high energy pulse circuits.
TO-3
Features:
n Repetitive Avalanche Ratings
n Dynamic dv/dt Rating
n Hermetically Sealed
n Simple Drive Requirements
n Ease of Paralleling


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