CYStech Electronics Corp.

Spec. No. : C968L3

Issued Date : 2014.12.23

Revised Date :

Page No. : 9/9

SOT-223 Dimension

*: Typical

Inches

Millimeters

MTB110P10L3

CYStek Product Specification

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.1142

0.1220

2.90

3.10

G

0.0551

0.0709

1.40

1.80

B

0.2638

0.2874

6.70

7.30

H

0.0098

0.0138

0.25

0.35

C

0.1299

0.1457

3.30

3.70

I

0.0008

0.0039

0.02

0.10

D

0.0236

0.0315

0.60

0.80

a1

-

-

E

*0.0906

-

*2.30

-

a2

F

0.2480

0.2638

6.30

6.70

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

3

2

1

F

B

A

C

D

E

Marking:

Device Name

Date Code

B110P10

□□□□

Style: Pin 1.Gate 2.Drain 3.Source

3-Lead SOT-223 Plastic

Surface Mounted Package

CYStek Package Code: L3

G

H

a1

a2

I