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CD4071 Scheda tecnica(PDF) 10 Page - Intersil Corporation

Il numero della parte CD4071
Spiegazioni elettronici  CMOS OR Gate
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Produttore elettronici  INTERSIL [Intersil Corporation]
Homepage  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

CD4071 Scheda tecnica(HTML) 10 Page - Intersil Corporation

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All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
CD4071BMS, CD4072BMS, CD4075BMS
Chip Dimensions and Pad Layouts
CD4071BMS
CD4072BMS
CD4075BMS
Dimensions in parentheses are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch)
METALLIZATION:
Thickness: 11k
Å
− 14kÅ, AL.
PASSIVATION:
10.4kÅ - 15.6k
Å, Silane
BOND PADS:
0.004 inches X 0.004 inches MIN
DIE THICKNESS:
0.0198 inches - 0.0218 inches


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