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CD40182BMS Scheda tecnica(PDF) 9 Page - Intersil Corporation

Il numero della parte CD40182BMS
Spiegazioni elettronici  CMOS Look-Ahead Carry Generator
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Produttore elettronici  INTERSIL [Intersil Corporation]
Homepage  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

CD40182BMS Scheda tecnica(HTML) 9 Page - Intersil Corporation

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7-1418
CD40182BMS
FIGURE 10. 64-BIT FULL CARRY LOOK-AHEAD ALU IN 3 LEVELS
FIGURE 11. COMBINED TWO-LEVEL LOOK-AHEAD AND RIPPLE-CARRY ALU
Cn
GP
Cn
G0 P0 Cn + x
Cn + y
Cn + z
GP
(16) CD40181BMS
CD40182BMS
Cn
GP
G1 P1
Cn
GP
G2 P2
Cn
GP
G3 P3
Cn
GP
Cn
G0 P0 Cn + x
Cn + y
Cn + z
CD40182BMS
Cn
GP
G1 P1
Cn
GP
G2 P2
Cn
GP
G3 P3
Cn
G0 P0
Cn + x
G1 P1
Cn + y
Cn
Cn
GP
G0 P0
CD40182BMS
Cn
Cn
Cn
GP
Cn
G0 P0 Cn + x
Cn + y
Cn + z
CD40182BMS
Cn
GP
G1 P1
Cn
G2 P2
Cn
G3 P3
Cn
Cn
Cn
GP
G0 P0
Cn
GP
G1 P1
Cn + x
Cn + y
CD40181BMS
Cn+4
Cn + 4
Cn + 4
GP
CD40181BMS
GP
Cn+4
Chip Dimensions and Pad Layout
The photographs and dimensions of each CMOS chip represent a chip when
it is part of the wafer. When the wafer is separated into individual chips, the an-
gle of cleavage may vary with respect to the chip face for different chips. The
actual dimensions of the isolated chip, therefore, may differ slightly from the
nominal dimensions shown. The user should consider a tolerance of -3 mils to
+16 mils applicable to the nominal dimensions shown.
Dimension in parenthesis are in millimeters and are derived from the basic inch
dimensions as indicated. Grid graduations are in mils (10-3 inch).
METALLIZATION:
Thickness: 11k
Å
− 14kÅ, AL.
PASSIVATION:
10.4kÅ - 15.6k
Å, Silane
BOND PADS:
0.004 inches X 0.004 inches MIN
DIE THICKNESS:
0.0198 inches - 0.0218 inches


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