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FDG6301N_F085 Scheda tecnica(PDF) 2 Page - Fairchild Semiconductor

Il numero della parte FDG6301N_F085
Spiegazioni elettronici  Dual N-Channel, Digital FET
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Produttore elettronici  FAIRCHILD [Fairchild Semiconductor]
Homepage  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FDG6301N_F085 Scheda tecnica(HTML) 2 Page - Fairchild Semiconductor

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Electrical Characteristics (T
A = 25
OC unless otherwise noted )
Symbol
Parameter
Conditions
Min
Typ
Max
Units
OFF CHARACTERISTICS
BV
DSS
Drain-Source Breakdown Voltage
V
GS = 0 V, ID = 250 µA
25
V
BV
DSS/TJ
Breakdown Voltage Temp. Coefficient
I
D = 250 µA, Referenced to 25
o C
25
mV /oC
I
DSS
Zero Gate Voltage Drain Current
V
DS = 20 V, VGS = 0 V
1
µA
T
J = 55°C
10
µA
I
GSS
Gate - Body Leakage Current
V
GS = 8 V, VDS = 0 V
100
nA
ON CHARACTERISTICS (Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS = VGS, ID = 250 µA
0.65
0.85
1.5
V
V
GS(th)/TJ
Gate Threshold Voltage Temp.Coefficient
I
D = 250 µA, Referenced to 25
o C
-2.1
mV /oC
R
DS(ON)
Static Drain-Source On-Resistance
V
GS = 4.5 V, ID = 0.22 A
2.6
4
T
J =125°C
5.3
7
V
GS = 2.7 V, ID = 0.19 A
3.7
5
I
D(ON)
On-State Drain Current
V
GS = 4.5 V, VDS = 5 V
0.22
A
g
FS
Forward Transconductance
V
DS = 5 V, ID= 0.22 A
0.2
S
DYNAMIC CHARACTERISTICS
C
iss
Input Capacitance
V
DS = 10 V, VGS = 0 V,
f = 1.0 MHz
9.5
pF
C
oss
Output Capacitance
6
pF
C
rss
Reverse Transfer Capacitance
1.3
pF
SWITCHING CHARACTERISTICS (Note 2)
t
D(on)
Turn - On Delay Time
V
DD = 5 V, ID = 0.5 A,
V
GS = 4.5 V, RGEN = 50
5
10
ns
t
r
Turn - On Rise Time
4.5
10
ns
t
D(off)
Turn - Off Delay Time
4
8
ns
t
f
Turn - Off Fall Time
3.2
7
ns
Q
g
Total Gate Charge
V
DS = 5 V, ID = 0.22 A,
V
GS = 4.5 V
0.29
0.4
nC
Q
gs
Gate-Source Charge
0.12
nC
Q
gd
Gate-Drain Charge
0.03
nC
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I
S
Maximum Continuous Source Current
0.25
A
V
SD
Drain-Source Diode Forward Voltage
V
GS = 0 V, IS = 0.25 A (Note 2)
0.8
1.2
V
Notes:
1. R
θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed
by design while R
θCA is determined by the user's board design. RθJA = 415
OC/W on minimum pad mounting on FR-4 board in still air.
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
FDG6301N_F085 Rev. A
www.fairchildsemi.com
2


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