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TP0604N3-G Scheda tecnica(PDF) 1 Page - Supertex, Inc |
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TP0604N3-G Scheda tecnica(HTML) 1 Page - Supertex, Inc |
1 / 5 page Supertex inc. Supertex inc. www.supertex.com TP0604 Doc.# DSFP-TP0604 C082012 Features ► Low threshold (-2.4V max.) ► High input impedance ► Low input capacitance (95pF typical) ► Fast switching speeds ► Low on-resistance ► Free from secondary breakdown ► Low input and output leakage Applications ► Logic level interfaces - ideal for TTL and CMOS ► Solid state relays ► Battery operated systems ► Photo voltaic drives ► Analog switches ► General purpose line drivers ► Telecom switches General Description This low threshold, enhancement-mode (normally-off) transistor utilizes a vertical DMOS structure and Supertex’s well-proven, silicon-gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors and the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally-induced secondary breakdown. Supertex’s vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired. P-Channel Enhancement-Mode Vertical DMOS FET Absolute Maximum Ratings Parameter Value Drain-to-source voltage BV DSS Drain-to-gate voltage BV DGS Gate-to-source voltage ±20V Operating and storage temperature -55OC to +150OC Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied. Continuous operation of the device at the absolute rating level may affect device reliability. All voltages are referenced to device ground. Pin Configuration TO-92 (N3) GATE SOURCE DRAIN YY = Year Sealed WW = Week Sealed = “Green” Packaging SiTP 0604 YYWW TO-92 (N3) Product Marking Package may or may not include the following marks: Si or Ordering Information Part Number Package Option Packing TP0604N3-G 3-Lead TO-92 1000/Bag TP0604N3-G P002 3-Lead TO-92 2000/Reel TP0604N3-G P003 TP0604N3-G P005 TP0604N3-G P013 TP0604N3-G P014 TP2404NW Die in wafer form --- TP2404NJ Die on adhesive tape --- TP2404ND Die in waffle pack --- Product Summary BV DSS/BVDGS (V) R DS(ON) (max) (Ω) I D(ON) (min) (A) V GS(th) (max) (V) -40 2.0 -2.0 -2.4 For packaged products, -G indicates package is RoHS compliant (‘Green’). TO-92 taping specifications and winding styles per EIA-468 Standard. Devices in Wafer / Die form are RoHS compliant (‘Green’). Refer to Die Specification VF57 for layout and dimensions. |
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