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93-10-02 Scheda tecnica(PDF) 3 Page - List of Unclassifed Manufacturers |
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93-10-02 Scheda tecnica(HTML) 3 Page - List of Unclassifed Manufacturers |
3 / 50 page STANDARD MICROCIRCUIT DRAWING SIZE A 77034 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL X SHEET 3 DSCC FORM 2234 APR 97 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device except for those devices that use a RHA designator Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non- JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style M See figure 1 3 Power surface mount N See figure 1 3 Surface mount T 1/ See figure 1 3 TO-257 flange mount, glass sealed U 1/ See figure 1 3 TO-257 flange mount with isolated tab, glass sealed X See figure 1 3 TO-39 can Y MBFM1-P2 2 Flange mount Z MBFM4-P2 2 Flange mount 2 CQCC1-N20 20 Square leadless chip carrier 4 See figure 1 3 SMD-257-A flange mount, glass sealed 5 See figure 1 18 Rectangular leadless chip carrier 6 See figure 1 18 Rectangular leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 2/ Power dissipation (PD): Case X ....................................................................................................... 2 W Cases M, N, T, U, Y, Z and 4 (internally limited) ....................................... 20 W Case 2: At TA = +25°C ......................................................................................... 1.1 W At TC = +25°C ........................................................................................ 6.2 W Cases 5 and 6 at TC = +25°C ..................................................................... 10 W Input-output voltage differential: Device types 01, 03, 05, 06 ....................................................................... 40 V dc Device types 02, 07 ................................................................................... 60 V dc Device types 04, 08 ................................................................................... 50 V dc Operating junction temperature range ........................................................... -55 °C to +150°C Storage temperature ..................................................................................... -65 °C to +150°C Lead temperature (soldering, 10 seconds) ................................................... 300 °C Thermal resistance, junction to case ( θ JC): Cases M, N, and T ................................................................................... 3.5 °C/W Cases U and 4 ........................................................................................ 4.2 °C/W Case X .................................................................................................... 15 °C/W Case Y .................................................................................................... 3 °C/W Case Z .................................................................................................... 5 °C/W Case 2 ..................................................................................................... See MIL-STD-1835 Cases 5 and 6 ......................................................................................... 13 °C/W 1/ For outline letters T and U, CAGE 34333 manufacturers the TO-257 package with ceramic seal. 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. |
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Descrizione simile - 93-10-02 |
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