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TS2DDR2811 Scheda tecnica(PDF) 3 Page - Texas Instruments

Il numero della parte TS2DDR2811
Spiegazioni elettronici  1-GHz BANDWIDTH, 8-CHANNEL SPST SWITCH
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Produttore elettronici  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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TS2DDR2811
www.ti.com
SCDS294 – DECEMBER 2009
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
4.6
V
VIN
Control input voltage range(2) (3)
–0.5
7
V
VI/O
Switch I/O voltage range(2) (3) (4)
–0.5
7
V
IIK
Control input clamp current
VIN < 0 or VIN > VCC
–50
mA
II/OK
I/O port clamp current
VI/O < 0 or VI/O > VCC
–50
mA
II/O
ON-state switch current(5)
±128
mA
Continuous current through VDD or GND
±100
mA
θJA
Package thermal impedance(6)
31.8
°C/W
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to ground, unless otherwise specified.
(3)
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4)
VI and VO are used to denote specific conditions for VI/O.
(5)
II and IO are used to denote specific conditions for II/O.
(6)
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
(1)
MIN
MAX
UNIT
VCC
Supply voltage
3
3.6
V
VIH
High-level control input voltage
SEL
2
5.5
V
VIL
Low-level control input voltage
SEL
0
0.8
V
VI
Input voltage
SEL
0
5.5
V
VI/O
Input/output voltage
0
VCC
V
TA
Operating free-air temperature
–40
85
°C
(1)
All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
ELECTRICAL CHARACTERISTICS
for 1000 Base-T Ethernet switching over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP(2) MAX
UNIT
VIK
SEL
VCC = 3.6 V,
IIN = –18 mA
–0.7
–1.2
V
IIH
SEL
VCC = 3.6 V,
VIN = VCC
±1
μA
IIL
SEL
VCC = 3.6 V,
VIN = GND
±1
μA
ICC
VCC = 3.6 V,
II/O = 0,
Switch ON or OFF
250
500
μA
CIN
SEL
f = 1 M Hz,
VIN = 0
2
2.5
pF
COFF
B port
VI = 0,
f = 1 MHz,
Outputs open,
Switch OFF
2.5
4
pF
CON
VI = 0,
f = 1 MHz,
Outputs open,
Switch ON
8
TBD
pF
rON
VCC = 3 V,
1.5 V
≤ VI ≤ VCC,
IO = –40 mA
4
6
rON(flat)
(3)
VCC = 3 V,
VI = 1.5 V and VCC,
IO = –40 mA
0.5
ΔrON
(4)
VCC = 3 V,
1.5 V
≤ VI ≤ VCC,
IO = –40 mA
0.4
1
(1)
VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs.
(2)
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(3)
rON(flat) is the difference of rON in a given channel at specified voltages.
(4)
ΔrON is the difference of rON from center (A4, A5) ports to any other port.
Copyright © 2009, Texas Instruments Incorporated
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