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TS3DS26227 Scheda tecnica(PDF) 1 Page - Texas Instruments |
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TS3DS26227 Scheda tecnica(HTML) 1 Page - Texas Instruments |
1 / 20 page 8 1 2 3 4 9 6 5 7 11 10 12 1 2 3 A B C D TS3DS26227 www.ti.com SCDS224B – JUNE 2008 – REVISED OCTOBER 2010 HIGH-BANDWIDTH DUAL SPDT DIFFERENTIAL SIGNAL SWITCH WITH INPUT LOGIC TRANSLATION Check for Samples: TS3DS26227 1 FEATURES APPLICATIONS • Cell Phones 2 • High-Bandwidth Data Paths – Up to 800 MHz • PDAs • Specified Break-Before-Make Switching • Portable Instrumentation • Control Inputs Reference to VIO • Low-Voltage Differential Signal Routing • Low Charge Injection • Mobile Industry Processor Interface (MIPI) • Excellent ON-State Resistance Matching Signal Routing • Low Total Harmonic Distortion (THD) YZT PACKAGE • 2.3-V to 3.6-V Power Supply (V+) (BOTTOM VIEW) • 1.65-V to 1.95-V Logic Supply (VIO) • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Performance Tested Per JESD 22 – 4000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) Table 1. TERMINAL ASSIGNMENTS – 200-V Machine Model (A115-A) A B C D 1 IN1 NO1 COM1 NC1 2 VIO GND GND V+ 3 IN2 NO2 COM2 NC2 DESCRIPTION/ORDERING INFORMATION The TS3DS26227 is a dual single-pole double-throw (SPDT) analog switch that is designed to operate from 2.3 V to 3.6 V. The device offers high-bandwidth data paths, and a break-before-make feature to prevent signal distortion during the transferring of a signal from one path to another. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable applications. The TS3DS26227 has a separate logic supply pin (VIO) that operates from 1.65 V to 1.95 V. VIO powers the control circuitry, which allows the TS3DS26227 to be controlled by 1.8-V signals. ORDERING INFORMATION TA PACKAGE(1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) NanoFree™ – WCSP (DSBGA) –40°C to 85°C Tape and reel TS3DS26227YZTR 0.23-mm Large Bump – YZT (Pb-free) (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (3) YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2008–2010, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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