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CD00251512 Scheda tecnica(PDF) 3 Page - STMicroelectronics

Il numero della parte CD00251512
Spiegazioni elettronici  N-channel 525 V, 0.95 ohm, 6 A, DPAK, TO-220FP, TO-220
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Produttore elettronici  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

CD00251512 Scheda tecnica(HTML) 3 Page - STMicroelectronics

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STD7N52DK3, STF7N52DK3, STP7N52DK3
Electrical ratings
Doc ID 16387 Rev 2
3/16
1
Electrical ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
TO-220
DPAK
TO-220FP
VDS
Drain-source voltage (VGS = 0)
525
V
VGS
Gate- source voltage
± 30
V
ID
Drain current (continuous) at TC = 25 °C
6
6 (1)
1.
Limited by package
A
ID
Drain current (continuous) at TC = 100 °C
4
4 (1)
A
IDM
(2)
2.
Pulse width limited by safe operating area
Drain current (pulsed)
24
24 (1)
A
PTOT
Total dissipation at TC = 25 °C
90
25
W
IAR
Avalanche current, repetitive or not-
repetitive (pulse width limited by Tj max)
3A
EAS
Single pulse avalanche energy
(starting Tj = 25°C, ID = IAR, VDD = 50 V)
100
mJ
VESD(G-S)
Gate source ESD(HBM-C = 100 pF,
R = 1.5 k
Ω)
2500
V
dv/dt (3)
3.
ISD ≤ 6 A, peak VDS < V(BR)DSS.
Peak diode recovery voltage slope
20
V/ns
di/dt
Diode reverse recovery current slope
400
A/µs
VISO
Insulation withstand voltage (RMS) from
all three leads to external heat sink
(t = 1 s; TC = 25 °C)
2500
V
Tstg
Storage temperature
-55 to 150
°C
Tj
Max. operating junction temperature
150
°C
Table 3.
Thermal data
Symbol
Parameter
Value
Unit
TO-220
DPAK
TO-220FP
Rthj-case Thermal resistance junction-case max
1.39
5
°C/W
Rthj-pcb
(1)
1.
When mounted on 1inch² FR-4 board, 2 oz Cu
Thermal resistance junction-pcb max
50
°C/W
Rthj-amb Thermal resistance junction-ambient max
62.5
62.5
°C/W
Tl
Maximum lead temperature for soldering
purpose
300
300
°C


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