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LMZ31503 Scheda tecnica(PDF) 3 Page - Texas Instruments

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Il numero della parte LMZ31503
Spiegazioni elettronici  3A SIMPLE SWITCHER Power Module with 4.5V-14.5V Input in QFN Package
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Produttore elettronici  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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LMZ31503
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SNVS992 – JULY 2013
THERMAL INFORMATION
LMZ31503
THERMAL METRIC(1)
RUQ47
UNIT
47 PINS
θJA
Junction-to-ambient thermal resistance(2)
13
ψJT
Junction-to-top characterization parameter(3)
2.5
°C/W
ψJB
Junction-to-board characterization parameter(4)
5
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance,
θJA, applies to devices soldered directly to a 100 mm x 100 mm double-sided PCB with
1 oz. copper and natural convection cooling. Additional airflow reduces
θJA.
(3)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is
the temperature of the top of the device.
(4)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is
the temperature of the board 1mm from the device.
PACKAGE SPECIFICATIONS
LMZ31503
UNIT
Weight
1.26 grams
Flammability
Meets UL 94 V-O
MTBF Calculated reliability
Per Bellcore TR-332, 50% stress, TA = 40°C, ground benign
40.1 MHrs
Copyright © 2013, Texas Instruments Incorporated
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