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AD871SD Scheda tecnica(PDF) 6 Page - List of Unclassifed Manufacturers |
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AD871SD Scheda tecnica(HTML) 6 Page - List of Unclassifed Manufacturers |
6 / 12 page STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94686 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55 °C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Logic input low current (CLK) 01 ±10 Logic input low current (OEN, CLK) IIL 1,2,3 02 ±10 µA Logic output high voltage ( MSB -Bit 12, OTR) VOH ISOURCE = 500 µA 1,2,3 01,02 2.4 V Logic output low voltage ( MSB -Bit 12, OTR) VOL ISINK = 1.6 mA 1,2,3 01,02 0.4 V Leakage IZ Three-state 1,2,3 02 ±10 µA Clock period tC Duty cycle = 50%, See figure 2 9,10,11 01,02 200 ns Output delay tOD See figure 2 9,10,11 01,02 10 ns 1/ Unless otherwise specified, AVDD = +5 V, AVSS = -5 V, DVDD = +5 V, and DRVDD = +5 V. 2/ The limiting term “min” (minimum) and “max” (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of a device terminal. 3/ Minimum resolution for which “no missing codes” is guaranteed. 4/ Test conditions for PSRR: 4.75 V ≤ AVDD ≤ 5.25 V, -5.25 V ≤ AVSS ≤ -4.75 V, 4.75 V ≤ DVDD ≤ 5.25 V. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA = +125 °C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. |
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