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FDG326P Scheda tecnica(PDF) 3 Page - Texas Instruments |
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FDG326P Scheda tecnica(HTML) 3 Page - Texas Instruments |
3 / 29 page TPS75003-EP www.ti.com SGLS311A – DECEMBER 2006 – REVISED MARCH 2011 Figure 1. Wirebond Plot THERMAL INFORMATION TPS75003-EP THERMAL METRIC(1) UNITS RHL (20 PINS) θJA Junction-to-ambient thermal resistance 42.6 θJCtop Junction-to-case (top) thermal resistance 51.8 θJB Junction-to-board thermal resistance 39.5 °C/W ψJT Junction-to-top characterization parameter 0.6 ψJB Junction-to-board characterization parameter 14.2 θJCbot Junction-to-case (bottom) thermal resistance 2.8 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2006–2011, Texas Instruments Incorporated 3 Product Folder Link(s): TPS75003-EP |
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