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SL1003A500 Scheda tecnica(PDF) 4 Page - Littelfuse |
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SL1003A500 Scheda tecnica(HTML) 4 Page - Littelfuse |
4 / 5 page ©2009 Littelfuse, Inc. Gas Discharge Tube (GDT) Products 43 Revised: November 10, 2009 Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications. SL1003A Series SL1003A Series Reflow Condition Pb-free assembly Pre Heat -Temperature Min (T s(min)) 150°C -Temperature Max (T s(max)) 200°C -Time (Min to Max) (t s) 60 – 180 seconds Average Ramp-up Rate (LiquidusTemp (T L) to peak) 3°C/second max. T S(max) to TL - Ramp-up Rate 5°C/second max. Reflow -Temperature (T L) (Liquidus) 217°C -Temperature (t L) 60 – 150 seconds PeakTemperature (T P) 260+0/-5 °C Time within 5°C of Actual Peak Temperature (t p) 10 – 30 seconds Ramp-down Rate 6°C/second max. Time 25°C to PeakTemperature (T P) 8 minutes max. Do not exceed 260°C Soldering Parameters - Reflow Soldering (Surface Mount Devices) Time TP TL TS(max) TS(min) 25 tP tL tS time to peak temperature (t 25ºC to peak) Ramp-down Ramp-up Preheat Critical Zone TL to TP Soldering Parameters - Wave Soldering (Thru-Hole Devices) Soldering Parameters - Hand Soldering Dwell Time 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 Time (Seconds) Cooling Time Preheat Time Wave Parameter Lead-Free Recommendation Preheat: (Depends on Flux Activation Temperature) (Typical Industry Recommendation) Temperature Minimum: 100 ° C Temperature Maximum: 150 ° C Preheat Time: 60-180 seconds Solder PotTemperature: 280 ° C Maximum Solder DwellTime: 2-5 seconds Recommended Process Parameters: Solder Iron Temperature: 350° C +/- 5°C Heating Time: 5 seconds max. |
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