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LM3279 Scheda tecnica(PDF) 5 Page - Texas Instruments

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Il numero della parte LM3279
Spiegazioni elettronici  LM3279 Buck-Boost Converter with MIPI RFFE Interfacefor 3G and 4G RF Power Amplifiers
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
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LM3279 Scheda tecnica(HTML) 5 Page - Texas Instruments

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LM3279
www.ti.com
SNVS970A – MARCH 2013 – REVISED MAY 2013
ABSOLUTE MAXIMUM RATINGS
(1) (2)
PVIN, VOUT to GND
−0.2V to +6.0V
PGND to SGND, GND
PGND
−0.2V to +0.2V
VIO, SDATA, SCLK, EN, VCON, GPO1/GPO0 to SGND, GND
−0.2V to (PVIN+0.2V) w/ 6.0V max
FB to PGND
−0.2V to (VOUT+0.2V) w/ 6.0V max
SW1, SW2
(PGND
−0.2V) to (PVIN +0.2V) w/ 6.0V max
Continuous power dissipation (3)
Internally Limited
Maximum operating junction temperature (TJ-MAX)
+150°C
Storage temperature range
−45°C to +150°C
Maximum lead temperature
(soldering)
(4)
ESD rating (5)
Human Body Model:
1 kV
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to the potential at the GND pins.
(3)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and
disengages at TJ = 125°C (typ.).
(4)
For detailed soldering specifications and information, please refer to Texas Instruments Application Note 1112: DSBGA Wafer
Level Chip Scale Package (AN-1112).
(5)
The human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. (MIL-STD-883 3015.7)
OPERATING RATINGS
(1) (2)
Input voltage range
2.7V to 5.5V
Output voltage range (digital control)
0.4V to 4.212V
Recommended current load
0 to 1000 mA
Operating ambient temperature (TA) range
(3)
−30°C to +85°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to the potential at the GND pins.
(3)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
THERMAL PROPERTIES
Junction-to-ambient thermal resistance (
θJA), YZR0016 Package
(1)
55°C/W
(1)
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design. Junction-to-ambient thermal resistance (
θJA)
is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7.
Copyright © 2013, Texas Instruments Incorporated
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