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TMP108 Scheda tecnica(PDF) 3 Page - Texas Instruments

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Il numero della parte TMP108
Spiegazioni elettronici  Low Power Digital Temperature Sensor With Two-Wire Serial Interface in WCSP
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
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TMP108
www.ti.com
SBOS663 – APRIL 2013
ELECTRICAL CHARACTERISTICS
At TA = +25°C, and V+ = +1.8 V, unless otherwise noted.
TMP108
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE INPUT
Range
–40
+125
°C
–20°C to +85°C
±0.15
±0.75
°C
Accuracy (temperature
error)
–40°C to +125°C
±0.3
±1
°C
Accuracy vs supply
±0.03
±0.3
°C/V
DIGITAL INPUT/OUTPUT
VIH
Input logic high level
0.7 (V+)
V+
V
VIL
Input logic low level
-0.5
0.3 (V+)
V
IIN
Input current
0 V < VIN < (V+) +0.3 V
1
μA
V+ > 2 V, IOUT = 3 mA
0.4
V
VOL
Output logic low level
V+ < 2 V, IOUT = 3 mA
0.2 (V+)
V
ALERT internal pull-up
ALERT to V+
80
100
120
k
Ω
resistor
Resolution
12
Bit
Conversion time
One-Shot mode
21
27
33
ms
CR1 = 0, CR0 = 0
0.25
Conv/s
CR1 = 0, CR0 = 1 (default)
1
Conv/s
Conversion modes
CR1 = 1, CR0 = 0
4
Conv/s
CR1 = 1, CR0 = 1
16
Conv/s
Timeout time
21
28
35
ms
POWER SUPPLY
Operating supply range,
1.4
3.6
V
V+ pin
Serial bus inactive, CR1 = 0, CR0 = 1 (default)
2
3.5
μA
Serial bus inactive, CR1 = 0, CR0 = 1 (default), –40°C to +125°C
6
μA
Serial bus active, SCL frequency = 400 kHz, CR1 = 0,
IQ
Quiescent current
12
μA
CR0 = 1 (default)
Serial bus active, SCL frequency = 3.4 MHz, CR1 = 0,
82
μA
CR0 = 1 (default)
Serial bus inactive
0.3
1
μA
ISD
Shutdown current
Serial bus active, SCL frequency = 400 kHz
10
μA
Serial bus active, SCL frequency = 3.4 MHz
80
μA
TEMPERATURE
Specified range
–40
+125
°C
Storage range
–55
+150
°C
THERMAL INFORMATION
TMP108
THERMAL METRIC(1)
YFF (DSBGA)
UNITS
6 PINS
θJA
Junction-to-ambient thermal resistance
132.7
θJC(top)
Junction-to-case(top) thermal resistance
1.7
θJB
Junction-to-board thermal resistance
23
°C/W
ψJT
Junction-to-top characterization parameter
6
ψJB
Junction-to-board characterization parameter
22.6
θJC(bottom)
Junction-to-case(bottom) thermal resistance
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2013, Texas Instruments Incorporated
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