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UC1611J883B Scheda tecnica(PDF) 5 Page - Texas Instruments |
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UC1611J883B Scheda tecnica(HTML) 5 Page - Texas Instruments |
5 / 7 page PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 5962-90538012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-9053801PA ACTIVE CDIP JG 8 1 TBD Call TI Call TI 5962-9053801V2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type 5962-9053801VPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UC1611J ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UC1611J883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UC1611L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type UC3611DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3611DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3611J ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UC3611N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3611NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3611Q OBSOLETE PLCC FN 20 TBD Call TI Call TI UC3611QTR OBSOLETE PLCC FN 20 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) |
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