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FDT434 Scheda tecnica(PDF) 2 Page - Fairchild Semiconductor |
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FDT434 Scheda tecnica(HTML) 2 Page - Fairchild Semiconductor |
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2 / 8 page  FDT434P Rev. C1 (W) Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = –250 µA –20 V ∆BVDSS ∆T J Breakdown Voltage Temperature Coefficient ID = –250 µA,Referenced to 25°C –28 mV/ °C IDSS Zero Gate Voltage Drain Current VDS = –16 V, VGS = 0 V –1 µA IGSSF Gate–Body Leakage Current, Forward VGS = 8 V, VDS = 0 V 100 nA IGSSR Gate–Body Leakage Current, Reverse VGS = –8 V VDS = 0 V –100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = –250 µA –0.4 –0.6 –1 V ∆VGS(th) ∆T J Gate Threshold Voltage Temperature Coefficient ID = –250 µA,Referenced to 25°C 2 mV/ °C RDS(on) Static Drain–Source On–Resistance VGS = –4.5 V, ID = –6 A VGS = –4.5 V, ID = –6 A TJ=125 °C VGS = –2.5 V, ID = –4 A 0.040 0.067 0.050 0.050 0.083 0.070 Ω ID(on) On–State Drain Current VGS = –4.5 V, VDS = –5 V –20 A gFS Forward Transconductance VDS = –10 V, ID = –6 A 6.5 S Dynamic Characteristics Ciss Input Capacitance 1240 pF Coss Output Capacitance 270 pF Crss Reverse Transfer Capacitance VDS = –10 V, V GS = 0 V, f = 1.0 MHz 100 pF Switching Characteristics (Note 2) td(on) Turn–On Delay Time 8 16 ns tr Turn–On Rise Time 15 25 ns td(off) Turn–Off Delay Time 45 65 ns tf Turn–Off Fall Time VDD = –5 V, ID = –1 A, VGS = –4.5 V, RGEN = 6 Ω 30 50 ns Qg Total Gate Charge 13 19 nC Qgs Gate–Source Charge 1.8 nC Qgd Gate–Drain Charge VDS = –10 V, ID = –6 A, VGS = –4.5 V 3nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current –1.3 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = –2.1 A (Note 2) –0.75 –1.2 V Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 42°C/W when mounted on a 1in 2 pad of 2 oz copper b) 95°/W when mounted on a .0066 in 2 pad of 2 oz copper c) 110°/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0% |
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