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FDG6304 Scheda tecnica(PDF) 2 Page - Fairchild Semiconductor

Il numero della parte FDG6304
Spiegazioni elettronici  Dual P-Channel, Digital FET
Download  8 Pages
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Produttore elettronici  FAIRCHILD [Fairchild Semiconductor]
Homepage  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FDG6304 Scheda tecnica(HTML) 2 Page - Fairchild Semiconductor

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Electrical Characteristics (T
A = 25
OC unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
OFF CHARACTERISTICS
BV
DSS
Drain-Source Breakdown Voltage
V
GS = 0 V, ID = -250 µA
-25
V
BV
DSS/TJ
Breakdown Voltage Temp. Coefficient
I
D = -250 µA, Referenced to 25
oC
-22
mV /
oC
I
DSS
Zero Gate Voltage Drain Current
V
DS = -20 V, VGS = 0 V
-1
µA
T
J = 55°C
-10
µA
I
GSS
Gate - Body Leakage Current
V
GS = -8 V, VDS = 0 V
-100
nA
ON CHARACTERISTICS (Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS = VGS, ID = -250 µA
-0.65
-0.82
-1.5
V
V
GS(th)/TJ
Gate Threshold Voltage Temp.Coefficient
I
D = -250 µA, Referenced to 25
oC
2
mV /
oC
R
DS(ON)
Static Drain-Source On-Resistance
V
GS = -4.5 V, ID = -0.41 A
0.85
1.1
T
J =125°C
1.2
1.9
V
GS = -2.7 V, ID = -0.25 A
1.15
1.5
I
D(ON)
On-State Drain Current
V
GS = -4.5 V, VDS = -5 V
-1.5
A
g
FS
Forward Transconductance
V
DS = -5 V, ID = -0.41 A
0.9
S
DYNAMIC CHARACTERISTICS
C
iss
Input Capacitance
V
DS = 10 V, VGS = 0 V,
f = 1.0 MHz
62
pF
C
oss
Output Capacitance
34
pF
C
rss
Reverse Transfer Capacitance
10
pF
SWITCHING CHARACTERISTICS (Note 2)
t
D(on)
Turn - On Delay Time
V
DD = -5 V, ID = -0.5 A,
V
GS = -4.5 V, RGEN = 6
7
15
ns
t
r
Turn - On Rise Time
8
16
ns
t
D(off)
Turn - Off Delay Time
55
80
ns
t
f
Turn - Off Fall Time
35
60
ns
Q
g
Total Gate Charge
V
DS = -5 V, ID = -0.41 A,
V
GS = -4.5 V
1.1
1.5
nC
Q
gs
Gate-Source Charge
0.31
nC
Q
gd
Gate-Drain Charge
0.29
nC
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I
S
Maximum Continuous Source Current
-0.25
A
V
SD
Drain-Source Diode Forward Voltage
V
GS = 0 V, IS = -0.25 A (Note 2)
-0.85
-1.2
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed
by design while RθCA is determined by the user's board design. RθJA = 415
OC/W on minimum pad mounting on FR-4 board in still air.
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
FDG6304P Rev.E1


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