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FDG6303 Scheda tecnica(PDF) 2 Page - Fairchild Semiconductor |
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FDG6303 Scheda tecnica(HTML) 2 Page - Fairchild Semiconductor |
2 / 8 page Electrical Characteristics (T A = 25 OC unless otherwise noted ) Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS BV DSS Drain-Source Breakdown Voltage V GS = 0 V, ID = 250 µA 25 V ∆BV DSS/∆TJ Breakdown Voltage Temp. Coefficient I D = 250 µA, Referenced to 25 oC 26 mV/ oC I DSS Zero Gate Voltage Drain Current V DS = 20 V, VGS = 0 V 1 µA T J = 55°C 10 µA I GSS Gate - Body Leakage Current V GS = 8 V, VDS = 0 V 100 nA ON CHARACTERISTICS (Note 2) V GS(th) Gate Threshold Voltage V DS = VGS, ID = 250 µA 0.65 0.8 1.5 V ∆V GS(th)/∆TJ Gate Threshold Voltage Temp.Coefficient I D = 250 µA, Referenced to 25 oC -2.6 mV/ oC R DS(ON) Static Drain-Source On-Resistance V GS = 4.5 V, ID = 0.5 A 0.34 0.45 Ω T J =125°C 0.55 0.77 V GS = 2.7 V, ID = 0.2 A 0.44 0.6 I D(ON) On-State Drain Current V GS = 2.7 V, VDS = 5 V 0.5 A g FS Forward Transconductance V DS = 5 V, ID = 0.5 A 1.45 S DYNAMIC CHARACTERISTICS C iss Input Capacitance V DS = 10 V, VGS = 0 V, f = 1.0 MHz 50 pF C oss Output Capacitance 28 pF C rss Reverse Transfer Capacitance 9 pF SWITCHING CHARACTERISTICS (Note 2) t D(on) Turn - On Delay Time V DD = 5 V, ID = 0.5 A, V GS = 4.5 V, RGEN = 50 Ω 3 6 ns t r Turn - On Rise Time 8.5 18 ns t D(off) Turn - Off Delay Time 17 30 ns t f Turn - Off Fall Time 13 25 ns Q g Total Gate Charge V DS = 5 V, ID = 0.5 A, V GS = 4.5 V 1.64 2.3 nC Q gs Gate-Source Charge 0.38 nC Q gd Gate-Drain Charge 0.45 nC DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS I S Maximum Continuous Source Current 0.25 A V SD Drain-Source Diode Forward Voltage V GS = 0 V, IS = 0.25 A (Note 2) 0.8 1.2 V Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. RθJA = 415 OC/W on minimum pad mounting on FR-4 board in still air. 2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%. FDG6303N Rev.E 1 |
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