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FDG6302 Scheda tecnica(PDF) 2 Page - Fairchild Semiconductor |
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FDG6302 Scheda tecnica(HTML) 2 Page - Fairchild Semiconductor |
2 / 8 page Electrical Characteristics (T A = 25 OC unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS BV DSS Drain-Source Breakdown Voltage V GS = 0 V, ID = -250 µA -25 V ∆BV DSS/∆TJ Breakdown Voltage Temp. Coefficient I D = -250 µA, Referenced to 25 oC -19 mV /oC I DSS Zero Gate Voltage Drain Current V DS = -20 V, VGS = 0 V -1 µA T J = 55°C -10 µA I GSS Gate - Body Leakage Current V GS = -8 V, VDS = 0 V -100 nA ON CHARACTERISTICS (Note 2) V GS(th) Gate Threshold Voltage V DS = VGS, ID = -250 µA -0.65 -0.9 -1.5 V ∆V GS(th)/∆TJ Gate Threshold Voltage Temp.Coefficient I D = -250 µA, Referenced to 25 oC 2 mV / oC R DS(ON) Static Drain-Source On-Resistance V GS = -4.5 V, ID = -0.14 A 7.3 10 Ω T J =125°C 11 17 V GS = -2.7 V, ID = -0.05 A 10.4 13 I D(ON) On-State Drain Current V GS = -4.5 V, VDS = -5 V -0.14 A g FS Forward Transconductance V DS = -5 V, ID = -0.14 A 0.12 S DYNAMIC CHARACTERISTICS C iss Input Capacitance V DS = -10 V, VGS = 0 V, f = 1.0 MHz 12 pF C oss Output Capacitance 7 pF C rss Reverse Transfer Capacitance 1.5 pF SWITCHING CHARACTERISTICS (Note 2) t D(on) Turn - On Delay Time V DD = -5 V, ID = -0.25 A, V GS = -4.5 V, RGEN = 6 Ω 5 12 ns t r Turn - On Rise Time 8 16 ns t D(off) Turn - Off Delay Time 9 18 ns t f Turn - Off Fall Time 5 10 ns Q g Total Gate Charge V DS = -5 V, ID = -0.14 A, V GS = -4.5 V 0.22 0.31 nC Q gs Gate-Source Charge 0.12 nC Q gd Gate-Drain Charge 0.05 nC DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS I S Maximum Continuous Source Current -0.25 A V SD Drain-Source Diode Forward Voltage V GS = 0 V, IS = -0.25 A (Note 2) -0.8 -1.2 V Notes: 1. R θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while R θCA is determined by the user's board design. RθJA = 415 OC/W on minimum pad mounting on FR-4 board in still air. 2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%. FDG6302P Rev.F1 |
Codice articolo simile - FDG6302 |
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Descrizione simile - FDG6302 |
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