Motore di ricerca datesheet componenti elettronici |
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FDG329N Scheda tecnica(PDF) 4 Page - Fairchild Semiconductor |
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FDG329N Scheda tecnica(HTML) 4 Page - Fairchild Semiconductor |
4 / 5 page FDG329N Rev C (W) Typical Characteristics 1 2 3 4 5 ID = 1.5A VDS = 5V 10 V 15V 0 90 180 270 360 450 0 5 10 15 20 VDS, DRAIN TO SOURCE VOLTAGE (V) CISS COSS CRSS f = 1 MHz V GS = 0 V Figure 7. Gate Charge Characteristics. Figure 8. Capacitance Characteristics. 0.01 0.1 1 10 100 0.1 1 10 100 VDS, DRAIN-SOURCE VOLTAGE (V) DC 1s 100ms RDS(ON) LIMIT VGS = 4.5V SINGLE PULSE RθJA = 333 oC/W TA = 25 oC 10ms 1ms 100µs 0 2 4 6 8 10 0.0000 1 0.0001 0.001 0.01 0.1 1 10 100 1000 t1, TIME (sec) SINGLE PULSE RθJA = 333°C/W TA = 25°C Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum Power Dissipation. 0.01 0.1 1 0.0001 0.001 0.01 0.1 1 10 100 1000 t1, TIME (sec) RθJA(t) = r(t) + RθJA RθJA = 333°C/W TJ - TA = P * RθJA(t) Duty Cycle, D = t1 / t2 P(pk) t1 t2 SINGLE PULSE 0.01 0.02 0.05 0.1 0.2 D = 0.5 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. |
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