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FDG326P Scheda tecnica(PDF) 2 Page - Fairchild Semiconductor |
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FDG326P Scheda tecnica(HTML) 2 Page - Fairchild Semiconductor |
2 / 5 page FDG326P Rev D(W) Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = –250 µA –20 V ∆BVDSS ∆T J Breakdown Voltage Temperature Coefficient ID = –250 µA, Referenced to 25°C –12 mV/ °C IDSS Zero Gate Voltage Drain Current VDS = –16 V, VGS = 0 V –1 µA IGSSF Gate–Body Leakage, Forward VGS = 8 V, VDS = 0 V 100 nA IGSSR Gate–Body Leakage, Reverse VGS = –8 V, VDS = 0 V –100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = –250 µA –0.4 –0.9 –1.5 V ∆VGS(th) ∆T J Gate Threshold Voltage Temperature Coefficient ID = –250 µA, Referenced to 25°C 2 mV/ °C RDS(on) Static Drain–Source On–Resistance VGS = –4.5 V, ID = –1.5 A VGS = –2.5 V, ID = –1.3 A VGS = –1.8 V, ID = –0.8 A VGS = –4.5 V, ID = –1.5 A, TJ = 125°C 105 140 210 125 140 180 250 200 m Ω ID(on) On–State Drain Current VGS = –4.5 V, VDS = –5 V –6 A gFS Forward Transconductance VDS = –5 V, ID = –1.5 A 5.3 S Dynamic Characteristics Ciss Input Capacitance 467 pF Coss Output Capacitance 85 pF Crss Reverse Transfer Capacitance VDS = –10 V, V GS = 0 V, f = 1.0 MHz 38 pF Switching Characteristics (Note 2) td(on) Turn–On Delay Time 8 16 ns tr Turn–On Rise Time 13 23 ns td(off) Turn–Off Delay Time 18 32 ns tf Turn–Off Fall Time VDD = –10 V, ID = 1 A, VGS = –4.5 V, RGEN = 6 Ω 816 ns Qg Total Gate Charge 4.4 7 nC Qgs Gate–Source Charge 1.0 nC Qgd Gate–Drain Charge VDS = –10 V, ID = –1.5 A, VGS = –4.5 V 0.8 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current –0.62 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = –0.62 A (Note 2) –0.75 –1.2 V Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a.) 170°C/W when mounted on a 1 in 2 pad of 2 oz. copper. b.) 260°C/W when mounted on a minimum pad. 2. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0% |
Codice articolo simile - FDG326P |
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Descrizione simile - FDG326P |
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