FDC5612 Rev. C

Figure 7. Gate-Charge Characteristics.

Figure 8. Capacitance Characteristics.

Figure 11. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in Note 1b.

Transient themal response will change depending on the circuit board design.

0.00001

0.0001

0.001

0.01

0.1

1

10

100

300

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t / t

1

2

R

(t) = r(t) * R

R

= 156°C/W

T - T

= P * R

(t)

A

J

P(pk)

θJA

θJA

θJA

θJA

0

1

2

3

4

5

0.1

1

10

100

1000

SINGLE PULSE TIME (SEC)

SINGLE PULSE

0

100

200

300

400

500

600

700

800

900

0

10

20304050

60

f = 1MHz

0

2

4

6

8

10

0

2

4

6

8

10

12

14

20 V

30 V

Figure 9. Maximum Safe Operating Area.

Figure 10. Single Pulse Maximum

Power Dissipation.

0.01

0.1

1

10

100

0.1

1

10

100

DC

1s

100m s

10m s

1m s

100

µs

SING L E PUL S E

o

C/W

o

C