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MLZ1005W Scheda tecnica(PDF) 8 Page - TDK Electronics

Il numero della parte MLZ1005W
Spiegazioni elettronici  Inductors for Decoupling Circuits
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Produttore elettronici  TDK [TDK Electronics]
Homepage  http://www.tdk.com
Logo TDK - TDK Electronics

MLZ1005W Scheda tecnica(HTML) 8 Page - TDK Electronics

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• All specifications are subject to change without notice.
002-06 / 20120514 / e533_mlz
(7/10)
Inductors for Decoupling Circuits
Multilayer/STD • Magnetic Shielded
MLZ Series MLZ2012
The MLZ Series is a line of multilayer choke coils for decoupling
power circuits.
The MLZ2012-W Series, a line of the MLZ Series, has increased
its DC superimposition characteristics by up to 250%compared
with existing products through the use of TDK's proprietary ferrite
material technology.
Also available is the MLZ2012-L Series. This series has lowered its
resistance by up to 50% compared with existing products through
the adoption of a new ferrite material and dense electrodes. This
series includes the E6 Series, which handles 1.0 to 15µH, hence it
is extremely useful in the power-supply design of low-voltage cir-
cuits.
FEATURES
• The W Series (IDC UP type) is a line of products that have
achieved the industry's bestDC superimposition characteristics.
According to research conducted in August 2010.
• The L Series (Low-resistance type) has lowered its resistance by
up to 50% compared with existing products.
• The D Series (High frequency type) is a line of decoupling coil
products for high frequencies. It can handle higher noise
frequencies.
• With its wider inductance range (0.1 to 47µH) and the addition of
the E6 Series, this series can satisfy a wide variety of
requirements.
APPLICATIONS
Modules such as digital cellular phone and camera module, Net-
books, note PCs, DSCs, DVCs, video games, portable memory
audio devices, navigation systems, PNDs, TVs, W-LANs, solid
state drives
SPECIFICATIONS
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L
W
(3) Management symbol
(4) Inductance
(5) Characteristic type
(6) Packaging style
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
Conformity to RoHS Directive
Operating temperature range
–55 to +125°C
[Including self-temperature rise]
Storage temperature range
–55 to +125°C(After mount)
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
MLZ
2012
A
1R0
W
T
(1)
(2)
(3)
(4)
(5) (6)
(7)
2012
2.0
1.25mm
R10
0.1
H
1R0
1.0
H
100
10.0
H
D
High frequency type
W
IDC-UP type
L
Low-resistance type
T
Taping [reel]
Packaging style
Thickness T(mm)
Quantity
Taping
0.85
4000 pieces/reel
1.25
2000 pieces/reel
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.


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