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OP-184 Scheda tecnica(PDF) 5 Page - Analog Devices |
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OP-184 Scheda tecnica(HTML) 5 Page - Analog Devices |
5 / 20 page REV. 0 –5– OP184/OP284/OP484 ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Differential Input Voltage 2 . . . . . . . . . . . . . . . . . . . . . ±0.6 V Output Short-Circuit Duration to GND 3 . . . . . . . . Indefinite Storage Temperature Range P, S Packages . . . . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Operating Temperature Range OP184/OP284/OP484E, F . . . . . . . . . . . . –40 °C to +125°C Junction Temperature Range P, S Packages . . . . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300 °C Package Type JA 3 JC Units 8-Pin Plastic DIP (P) 103 43 °C/W 8-Pin SOIC (S) 158 43 °C/W 14-Pin Plastic DIP (P) 83 39 °C/W 14-Pin SOIC (S) 92 27 °C/W NOTES 1Absolute maximum ratings apply to both DICE and packaged parts unless otherwise noted. 2For input voltages greater than 0.6 volts, the input current should be limited to less than 5 mA to prevent degradation or destruction of the input devices. 3 θ JA is specified for the worst case conditions; i.e., θ JA is specified for device in socket for cerdip and P-DIP packages; θ JA is specified for device soldered in circuit board for SOIC package. ORDERING GUIDE Temperature Package Package Model Range Description Option OP184EP –40 °C to +125°C 8-Pin Plastic DIP N-8 OP184ES –40 °C to +125°C 8-Pin SOIC SO-8 OP184FP –40 °C to +125°C 8-Pin Plastic DIP N-8 OP184FS –40 °C to +125°C 8-Pin SOIC SO-8 OP284EP –40 °C to +125°C 8-Pin Plastic DIP N-8 OP284ES –40 °C to +125°C 8-Pin SOIC SO-8 OP284FP –40 °C to +125°C 8-Pin Plastic DIP N-8 OP284FS –40 °C to +125°C 8-Pin SOIC SO-8 OP484EP –40 °C to +125°C 14-Pin Plastic DIP N-14 OP484ES –40 °C to +125°C 14-Pin SOIC SO-14 OP484FP –40 °C to +125°C 14-Pin Plastic DIP N-14 OP484FS –40 °C to +125°C 14-Pin SOIC SO-14 OP284 Die Size 0.065 × 0.092 Inch, 5,980 Sq. Mils Substrate (Die Backside) Is Connected to V–. Transistor Count, 62. OP484 Die Size 0.080 × 0.110 Inch, 8,800 Sq. Mils Substrate (Die Backside) Is Connected to V–. Transistor Count, 120. R3 Q1 –IN +IN QL1 QL2 Q4 Q3 Q2 QB5 QB6 RB2 QB3 R1 Q5 R2 QB4 JB2 QB1 CB1 N+ P+ M QB2 CC1 Q9 Q7 Q11 Q8 Q6 Q10 Q12 QB7 QB8 QB9 RB1 JB1 TP R4 R5 R6 RB3 CFF R7 R8 Q13 Q14 R10 Q15 RB4 QB10 CC2 C O Q17 Q16 R11 Q18 VCC OUT VEE R9 Figure 1. Simplified Schematic |
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