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ML465PYA222MLZ Scheda tecnica(PDF) 1 Page - Coilcraft lnc. |
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ML465PYA222MLZ Scheda tecnica(HTML) 1 Page - Coilcraft lnc. |
1 / 3 page 1102 Silver Lake Road Cary IL 60013 Phone Fax 800-981-0363 847-639-1508 E-mail Web cps@coilcraft.com www.coilcraft-cps.com ® © Coilcraft, Inc. 2012 Specifications subject to change without notice. Please check our website for latest information. Inductance2 DCR (mOhms)3 SRF (MHz)4 Irms (A)6 Part number1 ±20% (µH) typ max min typ Isat (A)5 20°C rise 40°C rise ML465PYA521MLZ 0.52 4.83 5.31 104 130 13.1 10.0 12.0 ML465PYA681MLZ 0.68 5.74 6.31 80 100 11.6 9.2 11.3 ML465PYA821MLZ 0.82 6.65 7.32 76 95 11.0 8.1 10.2 ML465PYA102MLZ 1.0 7.54 8.29 62 78 10.3 7.8 10.2 ML465PYA152MLZ 1.5 10.3 11.3 55 69 9.4 6.1 8.5 ML465PYA222MLZ 2.2 15.2 16.7 43 54 7.4 4.9 6.8 ML465PYA332MLZ 3.3 26.5 29.2 33 41 5.4 3.7 5.1 ML465PYA472MLZ 4.7 33.7 37.1 26 33 4.9 3.0 4.3 ML465PYA682MLZ 6.8 44.9 49.4 24 30 4.8 2.7 3.5 ML465PYA822MLZ 8.2 60.8 66.9 21 27 4.0 2.3 3.0 ML465PYA103MLZ 10 84.0 92.4 19 24 3.0 2.0 2.7 ML465PYA153MLZ 15 109 120 16 20 2.8 1.7 2.3 1. When ordering, please specify testing code: ML465PYA153MLZ Testing: Z = COTS H = Screening per Coilcraft CP-SA-10001 N = Screening per Coilcraft CP-SA-10004 2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc. 3. DCR measured on a micro-ohmmeter. 4. SRF measured using an Agilent/HP 4395A or equivalent. 5. Typical dc current at which the inductance drops 30% from its value without current. 6. Typical current that causes the specified temperature rise from 25°C ambient. 7. Electrical specifications at 25°C. Refer to Doc 362 “Soldering Surface Mount Components” before soldering. Irms Testing Irms testing was performed in still air on a 0.060 inch thick pcb with 4 oz copper traces (0.321 inch wide) capable of carrying 22 Amps. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. 4040 POWER INDUCTORS Document ML803-1 Revised 03/22/12 Terminations Tin-silver (96.5/3.5) over copper. Core material Composite Weight 0.35 – 0.37 g Ambient temperature –55°C to +115°C with Irms current, +115°C to +155°C with derated current Storage temperature Component: –55°C to +155°C. Tape and reel packaging: –55°C to +80°C Resistance to soldering heat Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C / 85% relative humidity) Enhanced crush-resistant packaging 500/7 ″reel Plastic tape: 12 mm wide, 0.3 mm thick, 8 mm pocket spacing, 4.27 mm pocket depth ■ High temperature materials allow operation in ambient temperatures up to 155°C ■ Passes vibration testing to 80 G and shock testing to 1000 G ■ Exceptionally low DCR – 4.83 mOhm ■ Soft saturation makes them ideal for VRM/VRD applications. HighReliabilityPowerInductors ML465PYA |
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