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DAC1008D750HN Scheda tecnica(PDF) 2 Page - NXP Semiconductors |
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DAC1008D750HN Scheda tecnica(HTML) 2 Page - NXP Semiconductors |
2 / 99 page DAC1008D750 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 5 January 2011 2 of 99 NXP Semiconductors DAC1008D750 2 ×, 4× or 8× interpolating DAC with JESD204A 3. Applications Wireless infrastructure: LTE, WiMAX, GSM, CDMA, WCDMA, TD-SCDMA Communication: LMDS/MMDS, point-to-point Direct Digital Synthesis (DDS) Broadband wireless systems Digital radio links Instrumentation Automated Test Equipment (ATE) 4. Ordering information Two’s complement or binary offset data format Fully compatible SPI port LMF = 421 or LMF = 211 support Industrial temperature range from −40 °Cto+85 °C Differential CML receiver with embedded termination Integrated PLL can be bypassed Synchronization of multiple DAC outputs Embedded complex modulator Table 1. Ordering information Type number Package Name Description Version DAC1008D750HN HVQFN64 plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 × 9 × 0.85 mm SOT804-3 |
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