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TMP006_1107 Scheda tecnica(PDF) 3 Page - Texas Instruments

Il numero della parte TMP006_1107
Spiegazioni elettronici  Infrared Thermopile Sensor in Chip-Scale Package
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
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TMP006_1107 Scheda tecnica(HTML) 3 Page - Texas Instruments

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TMP006
www.ti.com
SBOS518A
– MAY 2011 – REVISED JULY 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION(1)
PACKAGE
PRODUCT
PACKAGE
DESCRIPTION
TWO-WIRE ADDRESS
DESIGNATOR
TMP006YZF
WCSP-8
1,6 mm
× 1,6 mm WCSP
1000XXX
YZF
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
TMP006
MIN
MAX
UNIT
Supply voltage
V+
7
V
Input voltage
ADR1 pins
–0.5
VS + 0.5
V
Input voltage
SDA, SCL, DRDY, ADR0 pins
–0.5
7
V
Input current
10
mA
Operating temperature range
–55
+125
°C
Storage temperature range
–65
+150
°C
Junction temperature (TJ max)
+150
°C
Human body model (HBM)
2000
V
ESD rating:
Charged device model (CDM)
500
V
Machine model (MM)
200
V
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
THERMAL INFORMATION
TMP006YZF
THERMAL METRIC(1)
YZF
UNITS
8 PINS
θJA
Junction-to-ambient thermal resistance
123.8
θJCtop
Junction-to-case (top) thermal resistance
69
θJB
Junction-to-board thermal resistance
103
°C/W
ψJT
Junction-to-top characterization parameter
4.7
ψJB
Junction-to-board characterization parameter
55
θJCbot
Junction-to-case (bottom) thermal resistance
n/a
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright
© 2011, Texas Instruments Incorporated
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