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TMP006_1107 Scheda tecnica(PDF) 3 Page - Texas Instruments |
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TMP006_1107 Scheda tecnica(HTML) 3 Page - Texas Instruments |
3 / 21 page TMP006 www.ti.com SBOS518A – MAY 2011 – REVISED JULY 2011 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE INFORMATION(1) PACKAGE PRODUCT PACKAGE DESCRIPTION TWO-WIRE ADDRESS DESIGNATOR TMP006YZF WCSP-8 1,6 mm × 1,6 mm WCSP 1000XXX YZF (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) TMP006 MIN MAX UNIT Supply voltage V+ 7 V Input voltage ADR1 pins –0.5 VS + 0.5 V Input voltage SDA, SCL, DRDY, ADR0 pins –0.5 7 V Input current 10 mA Operating temperature range –55 +125 °C Storage temperature range –65 +150 °C Junction temperature (TJ max) +150 °C Human body model (HBM) 2000 V ESD rating: Charged device model (CDM) 500 V Machine model (MM) 200 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. THERMAL INFORMATION TMP006YZF THERMAL METRIC(1) YZF UNITS 8 PINS θJA Junction-to-ambient thermal resistance 123.8 θJCtop Junction-to-case (top) thermal resistance 69 θJB Junction-to-board thermal resistance 103 °C/W ψJT Junction-to-top characterization parameter 4.7 ψJB Junction-to-board characterization parameter 55 θJCbot Junction-to-case (bottom) thermal resistance n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): TMP006 |
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