ISL21007

2

FN6326.8

July 14, 2011

Ordering Information

PART NUMBER

(Notes 1, 2, 3)

PART

MARKING

(V)

GRADE

TEMP. RANGE

(°C)

PACKAGE

(Pb-Free)

PKG. DWG. #

ISL21007BFB812Z

21007BF Z12

1.250

±0.5mV, 3ppm/°C

-40 to +125

8 Ld SOIC

M8.15

ISL21007CFB812Z

21007CF Z12

1.250

±1.0mV, 5ppm/°C

-40 to +125

8 Ld SOIC

M8.15

ISL21007DFB812Z

21007DF Z12

1.250

±2.0mV, 10ppm/°C

-40 to +125

8 Ld SOIC

M8.15

ISL21007BFB820Z

21007BF Z20

2.048

±0.5mV, 3ppm/°C

-40 to +125

8 Ld SOIC

M8.15

ISL21007CFB820Z

21007CF Z20

2.048

±1.0mV, 5ppm/°C

-40 to +125

8 Ld SOIC

M8.15

ISL21007DFB820Z

21007DF Z20

2.048

±2.0mV, 10ppm/°C

-40 to +125

8 Ld SOIC

M8.15

ISL21007BFB825Z

21007BF Z25

2.500

±0.5mV, 3ppm/°C

-40 to +125

8 Ld SOIC

M8.15

ISL21007CFB825Z

21007CF Z25

2.500

±1.0mV, 5ppm/°C

-40 to +125

8 Ld SOIC

M8.15

ISL21007DFB825Z

21007DF Z25

2.500

±2.0mV, 10ppm/°C

-40 to +125

8 Ld SOIC

M8.15

ISL21007BFB830Z

21007BF Z30

3.000

±0.5mV, 3ppm/°C

-40 to +125

8 Ld SOIC

M8.15

ISL21007CFB830Z

21007CF Z30

3.000

±1.0mV, 5ppm/°C

-40 to +125

8 Ld SOIC

M8.15

ISL21007DFB830Z

21007DF Z30

3.000

±2.0mV, 10ppm/°C

-40 to +125

8 Ld SOIC

M8.15

NOTES:

1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin

plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free

products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

2. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

3. For Moisture Sensitivity Level (MSL), please see device information page for ISL21007. For more information on MSL please see techbrief TB363.